Preparation of Heat-Resistant Epoxy/Silica Hybrids Through A Novel Sol-Gel Process

Xue Xia,Guoqing Wang,Peng Yang,Hiroyuki Kagawa,Haitao Wang,Masahiro Suzuki,Wei Zhong,Qiangguo Du
DOI: https://doi.org/10.1177/096739111001800805
2010-01-01
Abstract:A series of hybrid materials based on the diglycidyl ether of bisphenol-A (DGEBA) and 3-glycidoxypropyltrimethoxysilane (GPTMS) were prepared via a modified sol-gel process. The curing process of hybrid materials was analyzed with an advanced rheometric expansion system (ARES) and differential scanning calorimetry (DSC). Dynamic mechanical analysis (DMA) and thermogravimetric analysis (TGA) were carried out to evaluate the thermal properties of the resulted epoxy hybrids. Copper clad laminates were also prepared by a traditional hot-press moulding procedure with the hybrid varnish, which showed an excellent heat-resistant performance This kind of hybrid material may be suitable for electronic applications due to their excellent high temperature reliability and stability.
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