Synthesis and properties of optically clear silicone resin/epoxy resin hybrids

Ying Zhang,Xin Yang,XiaoJuan Zhao,Wei Huang

DOI: https://doi.org/10.1002/pi.3189

IF: 3.213

2012-01-01

Polymer International

Abstract:Optically clear silicone/epoxy hybrid resins were synthesized. The silicone resin (SiR) carrying Si-H, Si-CH=CH(2) and Si-OH groups was prepared by hydrolytic condensation. The blends of SiR and diglycidyl ether of hydrogenated bisphenol A (DGEHBA) were cured through platinum-catalyzed hydrosilylation and aluminium acetylacetonate-catalyzed polymerization. The curing process was studied using differential scanning calorimetry and rigid-body pendulum rheometry. It was found that the ratio of SiR to DGEHBA plays a major role in the curing process. The Si-OH groups of SiR assist polymerization of DGEHBA, and react with the epoxy resin to prevent phase separation. The cured hybrid resins are single-phase materials with a transmittance of about 87% at 400 nm for a thickness of 3 mm using air as reference. UV resistance and thermal stability of the hybrids are largely dependent on the composition. The adhesive strength of the SiRs can be significantly improved by a small fraction of DGEHBA, with a marginal influence on UV resistance. However, increasing the epoxy proportion has a marked negative influence on thermal stability. Compounding stabilizers, especially thermal stabilizers, are essential, in particular for high epoxy content, if the hybrids are to be used for high-brightness light-emitting diode packaging. (C) 2011 Society of Chemical Industry