Curing Reaction of Organic Silane Modified Bisphenol F Epoxy Resin

HONG Xiao-Bin,XIE Kai,XIAO Jia-Yu
2007-01-01
Abstract:An novel organic silane, 3,3′,3″-trihydroxyltriphenoxy silane triglycidyl ether was synthesized. Curing behavior of the organic silane and modified bisphenol F epoxy was studied. The modifier has a lower reaction velocity than bisphenol F epoxy. The curing temperature range of organic silane containing 2% 2,4-Limidazol is 20 ℃ narrower than that of bisphenol F epoxy. Activation energy of 2,4-limidazol/organic silane/bisphenol F epoxy system was calculated to be 50.53 kJ/mol by Kissinge method, lower than that of unmodified bisphenol F system(66.68 kJ/mol). The frequency factor is lower also, which results in a lower velocity constant. The modified bisphenol F epoxy has a narrower curing temperature range, indicating that it can be cured more effectively. 3,3′,3″-Trihydroxyltriphenoxy silane triglycidyl ether can improve the properties of the cured epoxy resin, the thermal expansion coefficient below Tg is reduced by 18.8%, the internal stress is decreased by 22.8% and the crack resistance index is increased by 52.2%. Meanwhile, Tg temperature is hardly decreased.
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