Novel silicone–phenyl contained amine curing agent for epoxy resin: 1. Non-isothermal cure and thermal decomposition

jun cao,jijiang hu,hong fan,jintao wan,bogeng li
DOI: https://doi.org/10.1016/j.tca.2014.06.014
IF: 3.5
2014-01-01
Thermochimica Acta
Abstract:•A novel silicone–phenyl contained aliphatic polyamine was first time employed as the curing agent of epoxy resin.•The non-isothermal curing kinetics of DGEBA/PSPA was investigated with DSC.•The isoconversional method was used to analyze the effective activation of the curing reaction.•Thermo gravimetric analysis showed the cured DGEBA/PSPA was thermally stable up to 380°C.
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