Electronic Properties of Multilayer MoS2 Field Effect Transistor with Unique Irradiation Resistance

Yifan Zhang,Xiaofei Chen,Heshen Wang,Junfeng Dai,Jianming Xue,Xun Guo
DOI: https://doi.org/10.1021/acs.jpcc.0c09666
2021-01-01
Abstract:Due to their small size and low power consumption, two-dimensional (2D) MoS2 devices have emerged as attractive candidates for next-generation nanoelectronics. However, in some particular working environments, such as space applications or advanced nuclear energy systems, device degradation caused by ion irradiation is a huge challenge for practical applications. Herein, the irradiation resistance of single-layer and multilayer MoS2 field effect transistors (FETs) have been systematically studied by using 2 MeV He ions. Electrical measurements show that multilayer devices can withstand 3 X 10(12) cm(-2) fluence of He ion irradiation, which is at least an order of magnitude higher than that of single-layer devices. Raman and photoluminescence (PL) spectra indicate that the defect concentration in multilayer devices is less than that of single-layer devices, even if the irradiation dose is two orders of magnitude higher, since the displacement threshold energy of Mo and S atoms significantly increases with the increasing number of MoS2 layers. The defect configuration is directly observed by aberration-corrected scanning transmission electron microscopy (AC-STEM). Our results demonstrate the extraordinary resistance of multilayer MoS2 FETs under high irradiation conditions and expand their potential applications.
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