Abstract:The rapid advancement of micro-nano machining technology has led to a decrease in the dimensions of microdevices and microchips, following the principles of Moore's law. In addition to conventional semiconductor materials like silicon, emerging nanoscale materials such as nanowires, nanotubes, and two-dimensional materials are being considered as promising alternative constituent materials. The mechanical properties of these materials have a significant impact on the performance and service life of these microdevices and microchips. However, conventional mechanical testing methods have difficulty in accurately measuring the properties of these materials at the nanoscale due to limitations in displacement control and microforce sensing. Consequently, there is an urgent need to develop a micromechanical device capable of testing nanoscale solid materials. In this study, we propose a concept based on high-resolution image sequences for the design of an integrated micromechanical device capable of synchronously measuring the force and deformation of tested specimens. The device has been fabricated using ultrafast femtosecond laser etching technology, which offers an efficient and cost-effective approach for manufacturing microstructures and is suitable for processing various materials such as metals and nonmetals. The stiffness of the device plays a crucial role in the design of the micromechanical device, and a stiffness-matching criterion is introduced to ensure appropriate design parameters. The fabricated device is employed to conduct in-situ tension experiments on SiC nanowires and multilayer molybdenum disulfide nanosheet within a scanning electronic microscope, enabling accurate measurement of their strength, modulus, and fracture strain.

Online Test Structure for Measuring Young'S Modulus and Residual Stress of the Top Silicon Layer of Silicon-On-Insulator by A Pull-In Approach

Thin Layer Soi-Fets Used for Stress-Sensing and Its Application in Accelerometers

A Method of Measuring Young's Modulus and Residual Stress in Typical MEMS Structures Using a Surface Profilometer

Measurement of Young's modulus and residual stress of silicon microstructures

Characterization of the Young's Modulus and Residual Stresses for a Sputtered Silicon Oxynitride Film Using Micro-Structures

Study of Local Stress Using Stress-Absorbing Si Diaphragm

Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams

Study of techniques for measuring residual stress in micromachined films

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

A Simple Method for the Measurement of Young's Moduli of Bilayer Thin Films Based on the Electrostatic Drive Approach

New Methods for Measuring Mechanical Properties of Thin Films in Micromachining: Beam Pull-in Voltage (VPI) Method and Long Beam Deflection (LBD) Method

An integrated push-to-pull micromechanical device: Design, fabrication, and in-situ experiment

Measurement of Residual Stress in a Multi-Layer Semiconductor Heterostructure by Micro-Raman Spectroscopy

Ultra-sensitive, Highly Reproducible Film Stress Characterization Using Flexible Suspended Thin Silicon Plates and Local Curvature Measurements

An In-Situ Tester for Extracting Piezoresistive Coefficients.

Test Structures and Drie Topography for Bulk Silicon Mems Devices

Young's Modulus Characterization of Nano-Level Silicon Nanomembrane

Investigation of the Young's Modulus and the Residual Stress of 4H-SiC Circular Membranes on 4H-SiC Substrates

A new in situ residual stress measurement method for a MEMS thin fixed-fixed beam structure

Measurement Of Young'S Modulus And Residual Stress Of Micromembranes

A Universal Structure for Self-Aligned in Situ On-Chip Micro Tensile Fracture Strength Test