Abstract:Here, the key mechanisms and diverse applications of controlled voltage‐assisted chemical etching (ECE) and metal‐assisted chemical etching (MaCE) of silicon, spanning both micro and nanoscale dimensions, are reviewed. This review offers a distinctive understanding of ECE and MaCE technologies, highlighting the most recent achievements, and discussing their future perspectives in silicon micro and nano machining. Sculpting silicon at the micro and nano scales has been game‐changing to mold bulk silicon properties and expand, in turn, applications of silicon beyond electronics, namely, in photonics, sensing, medicine, and mechanics, to cite a few. Voltage‐ and metal‐assisted chemical etching (ECE and MaCE, respectively) of silicon in acidic electrolytes have emerged over other micro and nanostructuring technologies thanks to their unique etching features. ECE and MaCE have enabled the fabrication of novel structures and devices not achievable otherwise, complementing those feasible with the deep reactive ion etching (DRIE) technology, the gold standard in silicon machining. Here, a comprehensive review of ECE and MaCE for silicon micro and nano machining is provided. The chemistry and physics ruling the dissolution of silicon are dissected and similarities and differences between ECE and MaCE are discussed showing that they are the two sides of the same coin. The processes governing the anisotropic etching of designed silicon micro and nanostructures are analyzed, and the modulation of etching profile over depth is discussed. The preparation of micro‐ and nanostructures with tailored optical, mechanical, and thermo(electrical) properties is then addressed, and their applications in photonics, (bio)sensing, (nano)medicine, and micromechanical systems are surveyed. Eventually, ECE and MaCE are benchmarked against DRIE, and future perspectives are highlighted.

Study of the Relationship Between Metal-Assisted Chemical Etching and Direction of the Applied Electric Field

Uniform Vertical Trench Etching on Silicon with High Aspect Ratio by Metal-Assisted Chemical Etching Using Nanoporous Catalysts.

Metal Ions' Dynamic Effect on Metal-Assisted Catalyzed Etching of Silicon in Acid Solution

3-D finite element calculation of electric field enhancement for nanostructures fabrication mechanism on silicon surface with AFM tip induced local anodic oxidation

Uniform Metal-Assisted Chemical Etching for Ultra-High-Aspect-Ratio Microstructures on Silicon

Porosification-Induced Back-Bond Weakening in Chemical Etching of N-Si(111)

High Anodic-Voltage Focusing of Charge Carriers in Silicon Enables the Etching of Regularly-Arranged Submicrometer Pores at High Density and High Aspect-Ratio

Optimization of Metal-Assisted Etchant Components for Fabrication of Porous Silicon

Proximal probe-like nano structuring in metal-assisted etching of silicon

Selective etching of n-type silicon in pn junction structure in hydrofluoric acid and its application in silicon nanowire fabrication.

Formation Mechanism of Heavily Doped Silicon Mesopores Induced by Pt Nanoparticle-Assisted Chemical Etching

Voltage‐ and Metal‐assisted Chemical Etching of Micro and Nano Structures in Silicon: A Comprehensive Review

Wafer-Scale Fabrication of Ultra-High Aspect Ratio, Microscale Silicon Structures with Smooth Sidewalls Using Metal Assisted Chemical Etching

Low Cost and High‐Aspect Ratio Micro/Nano Device Fabrication by Using Innovative Metal‐Assisted Chemical Etching Method

Research on Silicon Wafer Surface Phase under the Ultra-thin Slicing Process and Its Etching Hindrance Behavior during Metal-Assisted Chemical Etching

Anisotropic Etching of Three-Dimensional Shapes in Silicon - the Important Role of Galvanic Interaction

Discrimination of Dislocation in Highly Doped N-Type 4H-Sic by Combining Electrochemical Reaction and Molten Alkali Etching

Photo-electrochemical Etching of Macroporous Silicon Arrays Used in Silicon Microchannel Plates

Catalysis of Dispersed Silver Particles on Directional Etching of Silicon

Chemical Etching Processes at the Dynamic GaAs/Electrolyte Interface in the Electrochemical Direct-Writing Micromachining

Electrochemical etching strategy for shaping monolithic 3D structures from 4H-SiC wafers