Abstract:Currently, stress analysis on direct bonded copper (DBC) is mainly based on a model with symmetrical top and bottom copper layers. These analyses provide thermal-mechanical stress-relieving methods at the outer edge of the copper-ceramic interface in DBC. However, these methods are unsuitable to release the concentrated stress at the inner gap edges where the top copper layer is etched into the circuit pattern. The stress-concentrated phenomenon causes initial delamination at the inner gap edge of the top copper-ceramic interface in DBC usage. Hence, this paper analyzed the mechanism of the phenomenon and proposed a bottom pattern design method to solve this problem. Through stress analysis on a simplified DBC model with etched top copper, the phenomenon can be explained by the large composite stress produced by the opposite bending actions of the top and bottom copper-ceramic interface in DBC. To reduce the effect of bending action on the bottom interface, parallel dimple traces are used on the bottom instead of a mirror-copied gap on consideration of thermal resistance and mechanical strength. The parameters of dimple trace were chosen by simulations on stress-strain results under thermal cycling and thermal resistance calculations in a module packaging. FE results show that the bottom dimple trace with a diameter of 0.4mm and a gap of 2mm can adjust the thermal-induced strain behavior of the singularities at the top copper to be even and sacrifices only a 2% thermal resistance rise of the module packaging. A life prediction model based on strain shows that the bottom design can improve the lifetime of the substrate. The thermal cycling test result on sample DBC and thermal resistance measurement on the module packaged by DBC with bottom pattern design verify the FE analysis. This method can be widely used in the packaging design of power modules using stand-alone DBC substrate.

Crack Initiation and Propagation Mechanism of Al2O3-DBC Substrate During Thermal Cycling Test

Microstructural analysis of the thermal fatigue tested Be/CuCrZr joint with artificial defects between Ti/Cu interlayers

DBC Substrate in Si- and SiC-based Power Electronics Modules: Design, Fabrication and Failure Analysis

An optimal structural design to improve the reliability of Al 2 O 3 –DBC substrates under thermal cycling

Al-clad Cu Bond Wires for Power Electronics Packaging: Microstructure Evolution, Mechanical Performance, and Molecular Dynamics Simulation of Diffusion Behaviors

Crack Initiation Criteria in EBC under Thermal Stress

Comparative Studies on Microstructures, Strengths and Reliabilities of Two Types of AlN Direct Bonding Copper Substrates

A Diffusion-Coupled Cohesive Element Model for Cracking Analysis of Thermal Barrier Coatings

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

Failure Analysis on the Abnormal Cracking of Si3N4 Ceramic Substrates for SiC Power Modules in New Energy Vehicles

Failure analysis on the abnormal cracking of Si 3 N 4 ceramic substrates for SiC power modules in new energy vehicles

Thermal fatigue failure mechanism in the joint of nano Cu/Ti–Si 3 N 4 ceramic substrates after thermal fatigue test

A Stress-Relieved Method Based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate

THz-TDS characterization of stress evolution of EB-PVD TBCs under thermal cycling

Failure Characteristics and Life Prediction for Thermally Cycled Thermal Barrier Coatings

Chemo-thermo-mechanical modeling of EB-PVD TBC failure subjected to isothermal and cyclic thermal exposures

Microstructural evolution during the crack propagation at the bond-wire contact area of IGBT power modules upon power cycling

Thermomechanical Stress Analysis, Characterization and Optimization for Double-Side Cooled Power Modules with Ceramic Substrate

Failure Mechanism of EB-PVD Thermal Barrier Coatings under the Synergistic Effect of Thermal Shock and CMAS Corrosion

Aging effect on high heat dissipation DBA and DBAC substrates for high power electronics

Experimental Investigation on High-Temperature Fatigue and Fracture Properties at the Interface Between Thermal Barrier Coatings (tbcs) and Nickel Based Superalloy Substrate