Thermal fatigue failure mechanism in the joint of nano Cu/Ti–Si 3 N 4 ceramic substrates after thermal fatigue test

Chenglai Xin,Mingchang Zhang,Qingyuan Wang,Dongya Li,Zhenliang Ma,Zhaoguo Yuan

DOI: https://doi.org/10.1016/j.ceramint.2024.01.285

IF: 5.532

2024-03-10

Ceramics International

Abstract:Thermal stress fatigue failure caused by mismatch in the coefficients of thermal expansion (CTE) between the metal layer and ceramic sheet during a high and low temperature cycle is considered as the big issue of high-power ceramic substrates. The aim of this study is to explore the thermal fatigue mechanism of nano Cu/Ti–Si 3 N 4 ceramic substrates after thermal fatigue test. Thermal fatigue test has been performed by thermal cycles experiment from −30 °C to 150 °C. After thermal cycles, the microstructure of the interface is observed by SEM and TEM . The results show after 400 thermal cycles, the nano-Cu metal layer oxidizes severely. Various oxides are found in the corrosion zone, such as CuO, CuAlO 2 and CuAl 2 O 4 . Higher dislocation density and nanoscale-twins are observed in Cu or Cu 2 O, which indicate that Cu and Cu 2 O alleviates thermal stress. As the number of thermal cycles increases, CuO CuAlO 2 , CuAl 2 O 4 as a corrosion layer in the corrosion zone were formed. The corrosion layer is difficult to alleviate interfacial thermal stress, and easy to form cracks in the joint zone.

materials science, ceramics