Comparative Studies on Microstructures, Strengths and Reliabilities of Two Types of AlN Direct Bonding Copper Substrates

Xin Wei,Haixian Xu,Jun Zhan,Hao Zhang,Ye Cao,Song Cui,Wenming Tang

DOI: https://doi.org/10.1016/j.ceramint.2018.07.131

IF: 5.532

2018-01-01

Ceramics International

Abstract:Oxidation of AlN ceramic plates was performed via two different techniques of Cu2+ activation followed by oxidation and direct oxidation. Two types of AlN direct bonding copper (DBC) substrates were then fabricated by combining the pre-oxidized Cu foils with the AlN plates. The interface structures, the peel strengths, and the temperature cycling reliabilities of the samples are investigated. The results showed that after Cu2+ activation followed by oxidation, rod-like CuAl2O4 particles were distributed on the dense α-Al2O3 layer oxide layer of the AlN plates. This microstructure is beneficial in improving the interface bonding strength and the wettability of the AlN-DBC substrates. Interface layers of both the AlN-DBC substrates were composed of two sublayers of Cu2O+CuAlO2 and residual Al2O3. During the peeling process, fractures occurred in the AlN plates for the Cu2+ activated and oxidized AlN-DBC substrates, but at the interface layer for the directly oxidized AlN-DBC substrates. The peel strength and the temperature cycling performance of the Cu2+ activated and oxidized AlN-DBC substrates were higher than the directly oxidized AlN-DBC substrates.