Bonding Mechanism of Direct Bond Copper to Alumina Substrate

ZY Fang,HP Zhou,H Chen
DOI: https://doi.org/10.3321/j.issn:1000-324x.2000.04.012
IF: 1.292
2000-01-01
Journal of Inorganic Materials
Abstract:Cu-Cu2O eutectic bonding of copper to Al2O3 was investigated. The highest peel strength was 11.5kg/cm for the specimen prepared at 1070 degrees C for 3h in nitrogen atmosphere. Oxygen promoted the wetting between copper and Al2O3 greatly. Cu[O] melt reacted with the alumina and formed a continuous CuAlO2 layer, which enhanced the peel strength of the joint. On cooling, the solidification front moved from the solid copper towards alumina, and Cu2O precipitated from the Cu[O] melt. When the solidification front met the CuAlO2 layer; liquid-aided reaction completed and a reliable bond was achieved between the copper and Al2O3 substrate.
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