Finite Element Simulation and Power Cycling Failure Analysis of IGBT Device Wire Bonding Joints
Jiayun Feng,Rui Wu,Yongfeng Cao,Jiaqi Li,Runze Wang,Shuai Jin,Yiping Wang,Yanhong Tian
DOI: https://doi.org/10.1109/icept63120.2024.10668628
2024-01-01
Abstract:IGBT devices have the advantages of high input impedance, good thermal stability, high current density, low on-state voltage drop, etc., and are widely used in new energy, rail transportation, electric vehicles, industrial applications, and household appliances. Currently, the main method for bonding IGBT devices is ultrasonic wedge bonding using thick Al wires. However, both the bonding process and the complex service conditions of IGBTs can cause a series of reliability issues for the devices. This article used finite element simulation analysis methods to analyze the failure modes and failure mechanisms of micro-interconnection wire bonding joints in the system-level packaging of IGBT power device. The impact of power cycling loads on the devices was analyzed, and the influence of Al wire bonding point span was also studied. This will help extend the service life of power devices, providing guidance for their structural design and bonding processes.