Abstract:Slicing and post-treatment of SiC crystals have been a significant challenge in the integrated circuit and microelectronics industry. To compete with wire-sawing and mechanical grinding technology, a promising approach combining laser slicing and laser polishing technologies has been innovatively applied to increase utilization and decrease damage defects for single crystal 4H-SiC. Significant material utilization has been achieved in the hybrid laser processes, where material loss is reduced by 75% compared to that of conventional machining technologies. Without any special process control or additional treatment, an internally modified layer formed by laser slicing can easily separate the 4H-SiC crystals using an external force of about similar to 3.6 MPa. The modified layer has been characterized using a micro-Raman method to determine residual stress. The sliced surface exhibits a combination of smooth and coarse appearances around the fluvial morphology, with an average surface roughness of over Sa 0.89 pm. An amorphous phase surrounds the SiC substrate, with two dimensions of lattice spacing, d = 0.261 nm and d = 0.265 nm, confirmed by high-resolution transmission electron microscopy (HRTEM). The creation of laser-induced periodic surface nanostructures in the laser-polished surface results in a flatter surface with an average roughness of less than Sa 0.22 pm. Due to the extreme cooling rates and multiple thermal cycles, dissociation of Si-C bonding, and phase separation are identified on the laser-polished surface, which is much better than that of the machining surface. We anticipate that this approach will be applicable to other high-value crystals and will have promising viability in the aerospace and semiconductor industries.(c) 2023 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.

Subsurface Damage and Phase Transformation in Laser-Assisted Nanometric Cutting of Single Crystal Silicon

One-Step femtosecond laser irradiation of Single-Crystal Silicon: Evolution of Micro-Nano structures and damage investigation

Surface Micromorphology and Nanostructures Evolution in Hybrid Laser Processes of Slicing and Polishing Single Crystal 4H-Sic

Anisotropy of Single-Crystal Silicon in Nanometric Cutting

Modifying single-crystal silicon and trimming silicon microring devices by femtosecond laser irradiation

Crystal Cleavage, Periodic Nanostructure And Surface Modification Of Sic Ablated By Femtosecond Laser In Different Media

Nanomechanical Properties of Single-Crystalline Silicon Wafer Irradiated by High-Energy Femtosecond Laser Pulses

Cohesive behavior of single crystalline silicon carbide scribing by nanosecond laser

Femtosecond Laser-Induced Phase Transformation on Single-Crystal 6H-SiC

Creating extreme subsurface integrity by laser-induced material self-organization

Research on the formation and evolution mechanism of cracks in laser stealth dicing of silicon carbide crystals

Simulation Study of Material Deformation in Monocrystal Silicon Nano-Machining

Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Investigation on the impact of thermal softening effect induced by nanosecond pulsed laser-assisted cutting on the deformation mechanism of SiCp/Al composites

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Cutting mechanism of reaction-bonded silicon carbide in laser-assisted ultra-precision machining

Experimental and Simulation Research on Femtosecond Laser Induced Controllable Morphology of Monocrystalline SiC

Centimeter-scale low-damage micromachining on single-crystal 4H–SiC substrates using a femtosecond laser with square-shaped Flat-Top focus spots

Laser Assisted Surface Conditioning of a Residual Pattern on Single Crystal Silicon Induced by Ultra-Precision Cutting

Cutting Performance of Single Crystal Silicon Anisotropic Surface in Micro-nano Scale