Abstract:Resistive switching memory (RRAM) with three-dimensional (3D) integration is one of the most effective methods to satisfy the requirement of ultra-high density and ultra-large data storage.With the increase of the integration density of 3D RRAM, Joule heating effect and thermal crosstalk of the RRAM device will seriously affect the stability, reliability and life of RRAM device.Therefore, the biggest challenge for 3D RRAM is how to solve the problem of the thermal effect.Otherwise, the thermal effect will be particularly prominent as the feature size of RRAM device is ceaselessly decreased.Especially with the improving of the storage cell densities and hence the decreasing of the distance between adjacent cells, the thermal crosstalk from the adjacent cells will seriously restrict the development and application of 3D integrated RRAM.In this work, we present a new electro-thermal compact model for 3D RRAM arrays.The proposed model is based on the electro-thermal analogy which can couple thermal network to its electrical schematic.The comparison between the compact model simulation results and numerical simulation shows a good accuracy.This proposed model can be used to predict temperature distribution and analyze thermal crosstalk in 3D RRAM arrays.Our work will provide a reliable technical support for the late circuit design and practical application, and lay the foundation for the realization of the high-density 3D integration RRAM.

3D Vertical RRAM Array and Device Co-design with Physics-based Spice Model

Parallel Modeling Fully Coupled Multiphysics Process in Resistive Random Access Memory Array

Fully Coupled Electrothermal Simulation of Resistive Random Access Memory (RRAM) Array

Electrothermal Simulation of Resistive Random Access Memory(RRAM) Array Using Finite Difference Method

Electrothermal Effects on Reliability of Vertical Resistive Random Access Memory Array by Parallel Computing

Electrothermal Study on Resistive Random Access Memory (RRAM) Arrays

Design And Optimization Methodology For 3d Rram Arrays

Modeling and Simulation of an Improved Resistive Random Access Memory Array

A Physics-based Compact Model for Set Process of Resistive Random Access Memory (RRAM) with Graphene Electrode

Variation-aware, Reliability-Emphasized Design and Optimization of RRAM Using SPICE Model

Study on High-Density Integration Resistive Random Access Memory Array From Multiphysics Perspective by Parallel Computing

Design guidelines for 3D RRAM cross-point architecture

Multiphysics Simulation of Multifilamentary Conduction Resistive Random Access Memory

A Compact Model for Electro-Thermal Co-Simulation of One Diode-One Resistor Random Access Resistive Memory

3D RRAM: Design and optimization

3-D Resistive Memory Arrays: from Intrinsic Switching Behaviors to Optimization Guidelines

Towards high-speed, write-disturb tolerant 3D vertical RRAM arrays

3D vertical RRAM - Scaling limit analysis and demonstration of 3D array operation

Device and SPICE modeling of RRAM devices.

Statistical assessment methodology for the design and optimization of cross-point RRAM arrays

A New Analytical Electro-Thermal Model in 3D Resistive Switching Memory Arrays