A Novel Approach for Copper Protection: UV Light Triggered Preparation of the Click-Assembled Film on Copper Surface

Kai Zhang,Jiamin Lu,Jin Li,Daquan Zhang,Lixin Gao,Yijun Wang
DOI: https://doi.org/10.1016/j.cej.2019.123406
IF: 15.1
2019-01-01
Chemical Engineering Journal
Abstract:Self-assembling process has been wildly used in the metal protection, and the better approaches to improve the assembled film are always explored. In this paper, a novel click-assembled approach triggered by UV light on copper surface is present. The results show the thiol-yne click reaction between dithiothreitol (DTT) and tertbutyl acetylene (TBA) is triggered on copper surface under the exposure of 365 nm UV light. The newly generated C-S bonds connect the inhibitor molecules on copper surface to form the thioether (TTA) film, the protective efficiency is 96.0%. This assembled approach triggered by light provides a new idea for the metal protection.
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