Abstract:As the most basic interconnection metallic material, copper (Cu) has been widely used in giant-large scale integrated circuits (GLSI). Corrosion inhibitors always play a crucial role in the Cu chemical mechanical polishing (CMP) process. The passivation of hydrogen peroxide (H2O2) alone is too weak to adequately protect against chemical corrosion on the surface of Cu film, thus, it is necessary to add corrosion inhibitors to the slurry. As a representative corrosion inhibitor, 1, 2, 4-triazole was compared with a novel corrosion inhibitor known as TT-LYK (ethanol, 2, 2′-[[(methyl-1H-benzotriazol-1-yl) methyl] imino] bis-), and their mixed inhibitor was studied in this paper. Different analytical methods such as the potentiodynamic polarization test, physical appearance phenomenon analysis, contact angle measurement and dynamic polishing experiment were used to compare their inhibition properties, and the fitting of different adsorption isotherms and static erosion tests were used to clarify the adsorption types and passivation processes respectively. The results indicated that both TT-LYK and 1, 2, 4-triazole achieved the goal of inhibiting Cu surface corrosion, but the inhibition effect of TT-LYK was slightly weaker at the same mass fraction. The corrosion protection of the two inhibitors is mainly attributable to the presence of organic inhibitor molecules on the surface of Cu by chemisorption and physisorption simultaneously. The passivation processes of both can be divided into two steps. First, the direct growth of the Cu-inhibitor passivation film occurs, followed by the redeposition of the Cu-inhibitor complex. From the results of electrochemical experiments, it can be concluded that the structure of the thin passivation film growing on the Cu surface varies with the inhibitor, and the composition of the passivation film was investigated by XPS and Raman spectrum analysis. At the same time, the surface roughness after polishing was found to decrease with the increase in inhibition effect of the inhibitors. According to the inhibition characteristics of these two inhibitors, a mixed corrosion inhibitor (TT-LYK and 1, 2, 4-triazole) was proposed in this study. Under the synergistic inhibition action, better inhibition effect and surface quality for Cu CMP were obtained. This outcome may be ascribed to the variation in the structure and density of the passivation film.

Surface-initiated atom transfer radical polymerization of triazole monomer from copper surface and its anticorrosion performance

In-situ preparation of triazole polymerization films on copper surface via SI-ATRP method and their performance against copper corrosion

Improvement on Stability of Polymeric Latexes Prepared by Emulsion Atrp Through Copper Removal Using Electrolysis

Well-controlled and stable emulsion ATRP of MMA with low surfactant concentration using surfactant–ligand design as the copper capture agent

1,2,4-Triazole as a corrosion inhibitor in copper chemical mechanical polishing

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Polyacrylic Acid as a Lubricant and a Complement to 1,2,4-Triazole for Copper Chemical Mechanical Polishing

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Preparation of Triazole Compounds Via Click Chemistry Reaction and Formation of the Protective Self-Assembled Membrane Against Copper Corrosion

Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI

Controlled Synthesis of Triazole Polymers Via Atrp/Click Chemistry Reaction and Preparation of Their Self-Assembled Film Against Copper Corrosion

Effect of Copper Surface State on the Protective Performance of Triazole Click-Assembly Film on Copper in Circulating Cooling Water of Power Plant

An Improved Approach to Prepare Triazole Protective Film by Click-Assembly on Copper Surface

Corrosion inhibition threshold effect of 1,2,4-triazole in alkaline chemical mechanical polishing of copper: Investigations using synchrotron radiation microinfrared

Mechanism of 1,2,4-Triazole During Copper Chemical Mechanical Planarization

Passivation Kinetics of 1,2,4-Triazole in Copper Chemical Mechanical Polishing

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A Recyclable and Reusable Supported Cu(I) Catalyzed Azide-Alkyne Click Polymerization.

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Protection of copper from corrosion through electrodeposited poly-2,5-dimercapto-1,3,4-thiadiazole–TiO2 composite film

Electrochemically Mediated Surface-Initiated Atom Transfer Radical Polymerization by ppm of CuII/Tris(2-pyridylmethyl)amine