Novel method for protecting copper: An in-situ click-assembly film on copper surface

Shuaijia Yang,Peng Zou,Yu Wang,Rui Song,Zhenyu Chen
DOI: https://doi.org/10.1016/j.colsurfa.2023.132355
IF: 5.518
2023-09-21
Colloids and Surfaces A Physicochemical and Engineering Aspects
Abstract:The in-situ self-assembled film on the copper surface is prepared via a novel click chemistry reaction between furfuryl mercaptan (FM) and tert-butyl acetylene (TBA). The formation of the click-assembled film on the copper surface is confirmed by Fourier transform infrared spectrum , Raman, and X-ray photoelectron spectroscopy analyses. The corrosion inhibition ability of the click-assembled film is evaluated using electrochemical methods. The impedance results indicate that the click-assembled film exhibits a maximum inhibition efficiency of up to 99.86 %, which is attributed to the formation of the C-S bond. This bond facilitates the attachment of corrosion inhibitors to the copper surface. Quantum chemistry calculations and molecule dynamics simulations are conducted to further elucidate the corrosion inhibition mechanism.
chemistry, physical
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