Super-hydrophobic film fabricated on Copper with electro-deposition method and its corrosion resistance

Peng Wang,Dun Zhang,Peng Ju
DOI: https://doi.org/10.4028/www.scientific.net/AMR.803.278
2013-01-01
Abstract:Copper film with rough structure is prepared on metal surface via electro-deposition. After modification of tetradecanoic acid, copper film presents super-hydrophobic property with water contact angle of 151.1 +/- 3 degrees, which could be attributed to the rough structure by trapping air. The adhesion test shows that the modified copper surface has low apparent water adhesion to the suspending droplet. Electrochemical measurement proves that super-hydrophobic film can inhibit corrosion of copper effectively. The method proposed in this paper is time-saving and facile to operate, and it offers a promising technique to prepare metallic surface with super-hydrophobic property.
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