Resistive Switching and Current Conduction Mechanisms in Hexagonal Boron Nitride Threshold Memristors with Nickel Electrodes (Adv. Funct. Mater. 15/2024)
Lukas Völkel,Dennis Braun,Melkamu Belete,Satender Kataria,Thorsten Wahlbrink,Ke Ran,Kevin Kistermann,Joachim Mayer,Stephan Menzel,Alwin Daus,Max C. Lemme
DOI: https://doi.org/10.1002/adfm.202470085
IF: 19
2024-04-11
Advanced Functional Materials
Abstract:Hexagonal Boron Nitride In article number 2300428, Alwin Daus, Max C. Lemme, and co‐workers explore hexagonal boron nitride (h‐BN) memristors for future computing. Based on temperature‐dependent current‐voltage analysis of Ni/h‐BN/Ni threshold memristors, they suggest a bias stress‐induced Ni‐filament formation and self‐rupture mechanism, in line with previous studies on h‐BN memristors. In conclusion, a valuable method is presented that can be adopted to investigate the RS mechanism of 2D‐materials‐based memristors.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology