Implementation of Two-Poly Differential MEMS Microphones for SNR and Sensing Range Enhancement

Sung-Cheng Lo,Chun-Kai Chan,Ya-chu Lee,Mingching Wu,Weileun Fang
DOI: https://doi.org/10.1109/memsys.2019.8870747
2019-01-01
Abstract:This study designs and implements the differential MEMS microphone (Fig. 1) to improve its signal-to-noise ratio (SNR) and sensing range using MOSBE process [1]. The microphone has three major merits: (1) achieve Differential MEMS Microphone using top/bottom diaphragm and top/bottom back-plate formed by two poly-Si layers (Fig. 1b); (2) reduce Low Frequency Acoustic Loss by removing release holes and adding surrounding mesa for diaphragm (Fig. 1b); (3) improve Sensing Area and Sensitivity through parallel plate gap-closing capacitance sensing enabled by rigid diaphragm with flexible U-shaped springs (Fig. 1c); and one minor merits: single sacrificial layer to define differential sensing gaps to reduce process induced thickness variation. Measurements indicate microphone of 800 μm “diameter” diaphragm: acoustic differential sensitivity is -40.5dB (Ref: 1V/1Pa) at 1kHz; ±3dB bandwidth ranges 50-20kHz; and the SNR is over 57.8dB.
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