The Influence of Columnar Microstructure on Diffusion Reaction Between Ti Thin Films and Aluminum Nitride Ceramics

Xiang Li,Hongkai Zhang,Chen Wang,Tingting Wang,Terigele,Yanhuai Li,Zhongxiao Song
DOI: https://doi.org/10.1016/j.surfcoat.2019.125057
IF: 4.865
2019-01-01
Surface and Coatings Technology
Abstract:In this paper, Ti films with certain thickness were deposited on a polished AIN ceramic substrates by direct current magnetron sputtering at room temperature (RT) and 400 degrees C, respectively. After deposition, the samples were annealed at 600 degrees C for 1 h in the mixture gases of argon and hydrogen atmosphere. The microstructure of the Ti films and interface reaction products between Ti/AIN were investigated using X-ray diffraction, and transmission electron microscopy. The effects of deposition temperature on the microstructure and grain orientation of Ti films were studied. It is found that the decomposition of AIN would mainly take place at the AIN/Ti interface during the heat-treated process. After annealing, Al and N react with Ti to produce AITi(3)N in the film deposited at 400 degrees C, while TiN0.3 be formed if deposited at RT. The subsequent rolling-contact-fatigue test proved that after annealing at 600 degrees C for 1 h, the adhesion strength of Ti/AlN interface deposited at 400 degrees C is superior to that deposited at RT.
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