Electrical Transport and Thermoelectric Properties of Te–Se Solid Solutions

Manman Yang,Hongyu Zhu,Wencai Yi,Shangsheng Li,Meihua Hu,Qiang Hu,Baoli Du,Xiaobing Liu,Taichao Su
DOI: https://doi.org/10.1016/j.physleta.2019.05.019
IF: 2.707
2019-01-01
Physics Letters A
Abstract:In this paper, p-type thermoelectric material Te–Se solid solutions have been successfully prepared by the high-pressure technique. The thermal conductivity of Te was depressed sharply by Se alloying. An extremely low thermal conductivity ∼0.27 Wm−1K−1 was obtained for Te alloyed with 15 mol% Se, which near the theoretical minimum, κmin. The bipolar diffusion effect of Te was suppressed by Se alloying due to the increased band gap, which lead to enhanced Seebeck coefficient and depressed bipolar diffusion thermal conductivity under high temperature. The maximum figure of merit, ZT of 0.37 at 480 K was obtained for Te alloyed with 5 mol% Se, which is about twice higher than that of pristine Te.
What problem does this paper attempt to address?