Abstract:The advent of three-dimensional stacked chips has significantly enhanced overall performance but introduced challenges in thermal analysis. To ensure the reliable operation of stacked chips and improve the design efficiency of heat sinks, a comprehensive exploration of thermal management issues, the formulation of practical thermal design principles, and the development of a foundational heat transfer analysis model are imperative. In this study, a three-dimensional stacked module is modeled using FloTHERM finite element simulation technology, and its temperature profile is subsequently simulated. The thermal resistance value of the module's shell is calculated to be 37.25 °C W −1 . Subsequently, utilizing the instantaneous state dual interface method, the junction-to-case thermal resistance of the module is experimentally measured using T3ster equipment. Two identical modules are tested, revealing a junction-to-case resistance value of 39.45 °C W −1 for module No. 1 and 40.50 °C W −1 for module No. 2—both approximately 40 °C W −1 , thereby validating the accuracy and repeatability of the tests. A comparative analysis between the simulated and experimental thermal resistance values indicates an error of approximately − 5.5% for module 1 and − 8.0% for module 2. Further analysis suggests potential sources of error, such as thermal conductivity of the plastic packaging material and hot spot distribution. The paper concludes with simulation-based analyses of plastic packaging material thermal conductivity and hot spot distribution, offering insights for refining the simulation model. This study verifies the correctness of the results obtained by using finite element analysis to build a model for thermal simulation analysis. It has reference value for the thermal simulation analysis and thermal resistance test method of 3D integrated package module.

An Effective Approach for Thermal Performance Analysis of Three-Dimensional Integrated Circuits with Through-Silicon Vias

An Effective Approach for Thermal Performance Analysis of 3-D Integrated Circuits with Through-Silicon Vias

System-Level Analysis of 3D ICs with Thermal TSVs

An Analytical Thermal Model for 3d Integrated Circuit Considering Through Silicon Via

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling

Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC

Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC

Thermal Modeling of Three-Dimensional Integrated Circuits Considering the Thermal Removal Capability of Different TSVs

Thermal Analysis of a Face-to-Back Bonded Four-Layer Stacked 3D IC Model

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

The thermal stress analysis in 3D IC integration with TSV interposer

Thermal analysis of four-layer 3D IC with TSVs based on face-to-back bonding

Thermal Analysis Of 3d Packaging With A Simplified Thermal Resistance Network Model And Finite Element Simulation

Nonlinear Electrothermal Model for Investigating Transient Temperature Responses of a Through-Silicon Via Array Applied with Gaussian Pulses in 3-D IC

Modeling and Characterization of Joule Heating in Metal Core of Tsv

Thermal Modeling and Analysis of 3-D ICs with Heat Dissipation Effect of Power Distribution Networks