Abstract:3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $\mu$m pitch can enable new ways of designing SoCs using all 3 dimensions, like folding a microprocessor design across multiple 3D tiers. However, overlapping thermal hotspots can be a challenge in such 3D stacked designs due to a general increase in power density. In this work, we perform a thorough thermal simulation study on sign-off quality physical design implementation of a state-of-the-art, high-performance, out-of-order microprocessor on a 7nm process technology. The physical design of the microprocessor is partitioned and implemented in a 2-tier, 3D stacked configuration with logic blocks and memory instances in separate tiers (logic-over-memory 3D). The thermal simulation model was calibrated to temperature measurement data from a high-performance, CPU-based 2D SoC chip fabricated on the same 7nm process technology. Thermal profiles of different 3D configurations under various workload conditions are simulated and compared. We find that stacking microprocessor designs in 3D without considering thermal implications can result in maximum die temperature up to 12°C higher than their 2D counterparts under the worst-case power-indicative workload. This increase in temperature would reduce the amount of time for which a power-intensive workload can be run before throttling is required. However, logic-over-memory partitioned 3D CPU implementation can mitigate this temperature increase by half, which makes the temperature of the 3D design only 6$^\circ$C higher than the 2D baseline. We conclude that using thermal aware design partitioning and improved cooling techniques can overcome the thermal challenges associated with 3D stacking.

Thermal Analysis of a Face-to-Back Bonded Four-Layer Stacked 3D IC Model

Thermal analysis of four-layer 3D IC with TSVs based on face-to-back bonding

System-Level Analysis of 3D ICs with Thermal TSVs

Thermal Modeling of a Chiplet-Based Packaging with a 2.5-D Through-Silicon Via Interposer

Investigation On The Effect Of Multiple Parameters Towards Thermal Management In 3d Stacked Ics

The thermal stress analysis in 3D IC integration with TSV interposer

A Finite Element Simulation for 3D-IC under Thermal Loads

An Effective Approach for Thermal Performance Analysis of Three-Dimensional Integrated Circuits with Through-Silicon Vias

An Effective Approach for Thermal Performance Analysis of 3-D Integrated Circuits with Through-Silicon Vias

Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling

Physical Modeling And Simulation Of Thermal Heating In Vertical Integrated Circuits

An Analytical Thermal Model for 3d Integrated Circuit Considering Through Silicon Via

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

Thermal Analysis Of 3d Packaging With A Simplified Thermal Resistance Network Model And Finite Element Simulation

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips

A Thermal Model for Top Layer of Three-dimensional Integrated Circuits with Through Silicon Via

Thermal Stress Analysis and Design Guidelines for Through Silicon Via Structure in 3D IC Integration

Thermal Characterization of Tsv Array As Heat Removal Element in 3d Ic Stacking

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic