Abstract:With the development of integrated circuit towards the characteristics of the low-power consumption, miniaturization and high integration, three-dimensional integration technology based on Through-Silicon Via (TSV) comes into being. However, the thermal accumulation caused by the maximum stack density and the thermal stress caused by the mismatched thermal expansion coefficient between TSV surrounding materials will lead to the reliability problems such as circuit function failure and device performance drift. In this paper, the heat dissipation performance and thermal-mechanical reliability of TSV array in 2.5D silicon interposer were studied when the operation temperature is increased from 20°C to 100°C. Firstly, the influences of the geometrical parameters, such as the through hole radius, depth to width ratio, insulation thickness and TSV spacing, on thermal-mechanical reliability were analyzed for single TSV, paired TSV and 3*3 TSV array structures. Secondly, a configuration of TSV regular hexagonal array in silicon interposer is proposed to improve its heat dissipation performance.Our simulation results disclose that the stress is mainly concentrated at the junction where SiO2 layer deviates to copper and silicon substrate deviates to SiO2, which indicates the SiO2 layer is most prone to fracture. The through hole radius should be designed as small as possible to reduce the thermal stress, and a thicker SiO2 insulation layer thickness will induce the better thermal-mechanical stability of TSV. The optimized TSV's depth to width ratio should be set above 5 with the simultaneous consideration of the stress for silicon substrate, insulating layer, filled copper. For multiple TSVs, the spacing should be greater than twice the diameter to eliminate the influence of thermal stress between TSVs. In addition, in the case of the same spacing, the equivalent unit temperature of TSV regular hexagonal array distribution is 2.9°C lower than that of conventional matrix array distribution. The analysis and design of TSV array in 2.5D silicon interposer is promising to offer guideline to the future advanced package development.

Thermal Stress Analysis and Design Guidelines for Through Silicon Via Structure in 3D IC Integration

The thermal stress analysis in 3D IC integration with TSV interposer

Brief Overview of the Impact of Thermal Stress on the Reliability of Through Silicon Via: Analysis, Characterization, and Enhancement

Comprehensive study of the impact of TSV induced thermo-mechanical stress on 3D IC device performance

Interfacial Stress in Through Silicon Vias

Sensitivity analysis of through-silicon via (TSV) interconnects for 3-D ICs

Impact of TSV Induced Thermo-Mechanical Stress on Semiconductor Device Performance

Stress Evolution Mechanism and Thermo-Mechanical Reliability Analysis of Copper-Filled TSV Interposer

Thermal-Mechanical Analysis of TSV Array in 2.5D Silicon Interposer

The Interfacial Thermo-Mechanical Reliability of 3D Memory-Chip Stacking with Through Silicon Via Array

Performanace and Reliability Analysis of 3D-Integration Structures Employing Through Silicon Via (TSV)

Reliable Design of Electroplated Copper Through Silicon Vias

Electric-thermo-mechanical Analysis of TSV under High Current Stressing

Influences of Size and Material of Through-Silicon Via on Thermo-mechanical Stress

Effects Of Via Pitch On Silicon Stress In Tsv Interposer

ANALYSIS OF THERMAL STRESS IN THROUGH SILICON VIA OF INTERPOSER

Finite Element Stress Analysis Of 3d Tsv Stack Subject To Large Temperature Loading

Analysis on Annealing-Induced Stress of Blind-Via TSV Using FEM

An Analytical Model of Thermal Mechanical Stress Induced by Through Silicon Via

Initial Thermal Stress and Strain Effects on Thermal Mechanical Stability of Through Silicon Via