Abstract:Single crystal silicon is necessarily subjected to mechanical precision machining to fulfill its applications in semiconductor and optoelectronics industries. However, brittle defects are inevitably formed on machined surface of intrinsically single crystal silicon. Thus, achieving ductile material removal is critical to obtain ultra-smooth machined surface of single crystal silicon. In the present work, we investigate the feasibility of ductile ultra-precision machining of single crystal silicon by applying the elliptical vibration diamond cutting technology. Grooving experiments demonstrate that silicon micro groove can be successfully formed in ductile mode by employing the elliptical vibration cutting, in contrast to the ordinary cutting that causes serious deterioration of finished surface due to formation of brittle defects. Furthermore, the nominal critical depth of cut for the brittle to ductile transition in the elliptical vibration cutting of single crystal silicon is more than 12 times higher than that in the ordinary cutting. It is found that the extremely small instantaneous uncut chip thickness and small cutting forces in the elliptical vibration cutting are advantageous to suppress crack propagations. Moreover, it is found that the vibration amplitude in the depth of cut direction has a prominent influence on both the nominal critical depth of cut and the machined surface quality. Finally, based on the gained fundamental understanding of brittle to ductile transition mechanisms, two types of high precision silicon microstructures, as sinusoidal grid surface and independent dimple patterns, respectively, are successfully sculptured on single crystal silicon by applying the amplitude-controlled ductile mode sculpturing method with arbitrarily changed depth of cut.

A Study on the Surface Quality and Brittle–ductile Transition During the Elliptical Vibration-Assisted Nanocutting Process on Monocrystalline Silicon Via Molecular Dynamic Simulations

A Simulation Investigation on Elliptical Vibration Cutting of Single-Crystal Silicon

A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation

Molecular Dynamics Simulation of Elliptical Vibration Cutting

Cutting characteristics of monocrystalline silicon in elliptical vibration nano-cutting using molecular dynamics method

Nano-Vibration Cutting Process of Single Crystal Silicon by Molecular Dynamics

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

Brittle-to-ductile Transition in Elliptical Vibration-Assisted Diamond Cutting of Reaction-Bonded Silicon Carbide

Investigations on Brittle-Ductile Cutting Transition and Crack Formation in Diamond Cutting of Mono-Crystalline Silicon

Research on Mechanism of Nanoscale Cutting with Arc Trajectory for Monocrystalline Silicon Based on Molecular Dynamics Simulation

Simulation Study of Material Deformation in Monocrystal Silicon Nano-Machining

Molecular Dynamics Analysis Micro-Mechanism Of Ductile Machining Single Crystal Silicon By Means Of Nanometric Cutting Technology

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Molecular Dynamics Simulation on the Mechanism of Nanometric Machining of Single-Crystal Silicon

Brittle-Ductile Transition In Diamond Cutting Of Silicon Single Crystals

Analysis about Diamond Tool Wear in Nano-Metric Cutting of Single Crystal Silicon Using Molecular Dynamics Method

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practical nominal cutting velocity

Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

Simulation Study of Cutting Forces, Stresses and Temperature During Nanometric Cutting of Single Crystal Silicon

Sculpturing of single crystal silicon microstructures by elliptical vibration cutting