AlN/GaN HEMTs with f max Exceeding 300 GHz by Using Ge-Doped n ++ GaN Ohmic Contacts
Liuyun Yang,Wei Huang,Ding Wang,Baoqing Zhang,Yibin Zhang,Junyun Zhang,Tangsheng Chen,Weikun Ge,Shaobing Wu,Bo Shen,Xinqiang Wang
DOI: https://doi.org/10.1021/acsaelm.3c00555
IF: 4.494
2023-09-11
ACS Applied Electronic Materials
Abstract:Here, we report a high-performance AlN/GaN high electron mobility transistor (HEMT) by using a heavily Ge-doped regrown GaN source and drain. We demonstrated that the compressive stress caused by Ge doping is proven for the first time via the lattice distortion along the [0001] axis in GaN by X-ray diffraction reciprocal space mapping (XRD-RSM) analysis. The Ge-doped GaN then affords a high electron concentration (n ∼ 2.5 × 1020 cm–3) with a crack-free surface and consequently leads to a low contact resistance of R c ∼ 0.09 Ω·mm for the HEMT. Thereupon, an enhanced current gain cutoff frequency and maximum oscillation frequency of f T/f max ∼ 140/301 GHz for a 70 nm gate length is achieved, along with a large maximum drain current density of I max ∼ 1.54 A/mm and a high transconductance of G m ∼ 0.74 S/mm. These results are evidently preferable to those of the contrastive HEMT with rapid-thermal-annealed Ohmic contacts. This study provides a viable approach to better device gain and frequency performance for ultrascale GaN-based devices..
materials science, multidisciplinary,engineering, electrical & electronic