Analysis of Damage Induced by FIB Irradiation in Microprocess

SONG Yun,LU Hai-wei,WANG Zhen-iong,ZHENG Guo-xiang,LI Yue-sheng,ZENG Wei
DOI: https://doi.org/10.3969/j.issn.0427-7104.2007.01.021
2007-01-01
Abstract:The irradiation effect of Focused Ion Beam (FIB) on preparation of TEM (transmission electron microscopy) sample was studied. Two types of MOS transistors, normal NMOS transistor and PMOS transistor with buried channel, were analyzed. The structural damage of the devices induced by FIB irradiation was studied. The change of transconductance and mobility in PMOS transistors with buried channel was similar to that of NMOS transistors, while the PMOS transistors showed their characteristic of threshold voltage self-fixing.
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