The Research of Anti-Adhesive Film by RIE Deposition in MEMS/NEMS

GU Pan,LIU Jing-quan,CHEN Di,SUN Hong-wen
DOI: https://doi.org/10.3969/j.issn.1004-1699.2006.05.021
2006-01-01
Abstract:Friction and stiction have been the important factors affecting the performance and reliability of MEMS/NEMS. To solve the surface modification problems of microstructure in MEMS/NEMS, we use the RIE to deposite the fluosilicate film on the surface of Si and decrease its surface energy. The paper includes the comparison between the RIE deposition films and SAMs films in the aspects of contact angle, surface energy and average roughness.
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