Research progress in thermal conductivity of SiCceramics
Bo Dong,Chao Yu,Chengji Deng,Hongxi Zhu,Jun Ding,Hui Tang
DOI: https://doi.org/10.11868/j.issn.1001-4381.2021.001040
2023-01-01
Abstract:ceramics has been extensively used in heat exchangers because of their excellent mechanicalproperties,high thermal conductivity,and superior thermal shock,corrosion,and oxidationresistance.However,thereisawidevariationinthethermalconductivityofSiCceramics, dependingontheraw materials,molding process,sintering process,andsinteringadditives.The thermalconductivityofSiCceramics(<= 270 W center dot m-1 center dot K-1)ismuchlowerthanthatof6H-SiCsingle crystals(490 W center dot m-1 center dot K-1)becauseofpores,grain boundaries,impurities,and defectsin SiC ceramics.Inthiswork,theimportantfactorsaffectingthethermalconductivityofSiCceramicswere analyzed,includingtemperature,pore,crystalstructure,andsecondphase.Further,thepreparation processes of high conductivity SiC ceramics were systematically compared based on hot-pressed sintering,spark plasma sintering,pressureless sintering,recrystallization sintering,and reaction sintering.Theimprovement measures ofthermalconductivityof SiC ceramics were summarized, includingtheoptimizationofthetypeandcontentofsinteringaids,high-temperatureannealing,and addingahigh-thermal-conductivitysecondphase.Finally,theprospectsandresearchdirectionsoflow-costandhigh-thermal-conductivitySiCceramicsareproposed.