The Influences of Traces of Oxygen and Sulfide on the Corrosion of Copper in Concentrated Chloride Solutions
S. Ramamurthy,J. Chen,D. Zagidulin,J.D. Henderson,C. Lilja,E. Bergendal,M. Behazin,N. Diomidis,P.G. Keech,J.J. Noël,D.W. Shoesmith
DOI: https://doi.org/10.1016/j.corsci.2024.112047
IF: 7.72
2024-04-11
Corrosion Science
Abstract:The corrosion of wrought, electrodeposited, and cold spray deposited copper was electrochemically monitored for ~160 days in 3 M NaCl solution containing traces of sulfide under anoxic and Ar-purged conditions. Corroded specimens were analyzed using scanning electron microscopy and Raman and X-ray photoelectron/Auger spectroscopies. Under anoxic conditions, corrosion was supported by sulfide only and the rate decreased with time causing only minor damage. Under low oxygen conditions maintained by Ar-purging, the rate increased with time and significant damage was observed, attributed to oxy-sulfur species formation. These results suggest that oxy-sulfur species, not just sulfide, are required to cause intergranular corrosion.
materials science, multidisciplinary,metallurgy & metallurgical engineering