Abstract:In the past few decades, silicon (Si) complementary metaloxide-semiconductor (CMOS) field-effect transistors have been scaled exponentially over time for the demand of drive current enhancement and cost reduction.As the technology node advances into sub-20 nm regimes, Si CMOS encounters immense challenges from both processing and theoretical perspectives.To maintain or further improve the transistor performance, Ge-based electronic transistors are explored as Ge exhibits higher hole and electron mobilities.As compared with the Si CMOS process, the process for fabricating high performance Ge-based transistors is still under development.This special issue aims to address some of the challenges encountered in the state-of-the-art technology, for both the Si-and Ge-based electronic transistors.For Ge MOSFETs, interface engineering and gate dielectric engineering are necessary to reduce the electrical active defects in the Ge surface and the high-/Ge interface.Other than Ge, SiGe is another possible channel material for the future CMOS technology.SiGe could be obtained by directly growing on Si substrate and therefore it has better compatibility with Si CMOS technologies.Besides the research works on Ge-based transistors, this special issue also includes some papers on the Si lateral diffused MOS (LDMOS).Novel structural designs were demonstrated to improve the performance and reliability of the Si LDMOS.Last but not least, this issue also reports a work on increasing the responsivity of the Si n-MOSFET photodetectors.We hope that readers of this special issue will find not only the accurate and most updated data in the papers, but also important solutions for the existing issues in the theory and fabrication of Si-and Ge-based electronic transistors.

Study of unique pseudo buried layer in 0.18um SiGe BiCMOS process

0.18 Micron BiCMOS Process with Novel Structure SiGeC HBT

Performance Comparison Between Si and Ge pDG-FETs for Different Channel Lengths Based on Hole Transport Simulation

A Low Cost & High Performance PNP Transistor Design & Fabrication in SiGe BiCMOS

Demonstration of Ultra-Thin Buried Oxide Germanium-on-insulator MOSFETs by Direct Wafer Bonding and Polishing Techniques

Design of High Speed PNP Transistor for SiGe BiCMOS Process

Lithography Solutions in Novel High Frequency Sige Hbt Device

Ultra High-voltage SiGe HBT with Non-epi Collector

The development of novel STI spacer in an EPI free SiGe BiCMOS Process

Emitter-base short issue study and improvement in a low cost and high performance 0.18um SiGe BiCMOS process

Si- and Ge-Based Electronic Devices

Design and Fabrication of High Speed NPN SiGe Heterojunction Bipolar Transistor

High Performance Junctionless FDSOI SiGe Channel P-Finfet with High ION/IOFF Ratio and Excellent SS

Fabrication of a Novel SOI Material with Non-Planar Buried Oxide Layer

UHV/CVD i-Si epitaxy and ion implantation doping for sub-micrometer N -Collector of SiGeHBT

On the Intrinsic Spacer Layer in Si/SiGe Heterojunction Bipolar Transistor Grown by Ultra High Vacuum Chemical Vapor Deposition

Development on Si/SiGe heterojunction bipolar transistors

p-i-n Switch Diode Design in SiGe HBT BiCMOS Process

SiGe HBT Device in Mixed Dry Wet Etching

A novel PIN switch diode integrating with 0.18um SiGe HBT BiCMOS process

Realizing High Breakdown Voltage SJ-LDMOS on Bulk Silicon Using a Partial N-Buried Layer