UHV/CVD i-Si epitaxy and ion implantation doping for sub-micrometer N -Collector of SiGeHBT

Wei Zhang,Huiwang Lin,L. Yue,Changchun Chen,Zhihong Liu,Yashi Lu,Weizhi Dou,Peihsin Hsin Tsien
2006-01-01
Journal of Ceramic Processing Research
Abstract:A method for sub-micrometer N-collector layer fabricated by Ultra-High Vacuum Chemical Vapor Deposition i-Si epitaxy and ion implantation doping is presented in this paper. The characteristics of this sub-micrometer N-collector layer are investigated. The Spreading Resistance Probe figures show that the transition region of the N-collector dopant profile is steep and the measure by an Atomic Force Microscope shows that the surface roughness is strongly related to the growth condition of the i-Si. The rocking curve by X-Ray Diffraction and the performance of SiGe Heterojunction Bipolar Transistor device demonstrate the good quality of the SiGe layer grown on this kind of N-collector layer. The BVcbo of the SiGeHBT with this sub-micrometer N-collector is 23.5V high, and the fT is 11 GHz.
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