Abstract:Various nanostructures, such as nanopillars and nanoholes, have served as vital functional components for construction of high-performance electronic and photonic devices. Precise control of nanostructures morphology becomes particularly important. In this study, a facile anisotropic etching approach was proposed based on an inductively coupled plasma-reactive ion etching. The method was applied to realize silicon nanopillars and nanoholes with vertical and smooth trench profiles. Gas mixture of SF6 and C4F8 was adopted in the proposed etching process to enable simultaneous etching and passivation. To protect the trench profiles of silicon nanostructures from high-energy ion bombardment, a bias power source was applied. By properly altering the ratio of SF6 to C4F8, the silicon nanopillars and nanoholes demonstrated highly straight trench profiles. Notably, the smooth nanopillars with low damage were easily realized via the SF6/C4F8 etching step. However, nanoholes suffer from polymer redeposition, ascribed to failure in completely removing residual polymer coatings at the trench sidewalls. To realize nanoholes with smooth sidewalls, a Ar treatment step was introduced to remove residual polymer coatings by enabling an effective physical surface bombardment after the SF6/C4F8 chemical etching step. Through a comprehensive study on effect of Ar treatment on trench profiles of silicon nanoholes, we confirmed that the nanoholes featuring smooth trench profiles can be obtained by properly adjusting the Ar gas flow and treatment time.

Preparation of composite micro/nano structure on the silicon surface by reactive ion etching: Enhanced anti-reflective and hydrophobic properties

Ultra-Low-Reflective, Self-Cleaning Surface by Fabrication Dual-Scale Hierarchical Optical Structures on Silicon

Reflectivity of porous-pyramids structured silicon surface

Superhydrophobic silicon surfaces with micro-nano hierarchical structures via deep reactive ion etching and galvanic etching.

Formation Mechanism of Multi-Functional Black Silicon Based on Optimized Deep Reactive Ion Etching Technique with SF 6 /C 4 F 8

Reduction of Reactive-Ion Etching-Induced Ge Surface Roughness by SF 6 /CF 4 Cyclic Etching for Ge Fin Fabrication

Improvement of conversion efficiency of multicrystalline silicon solar cells by incorporating reactive ion etching texturing

Large-scale Patterning of Hydrophobic Silicon Nanostructure Arrays Fabricated by Dual Lithography and Deep Reactive Ion Etching

RIE of SiO_2 Nanoparticles and Its Application in Preparation of Silicon Nanopillar Array

Rapid anisotropic chemical etching for quick formation of novel octagonal pyramids on silicon surface for photovoltaics

Micro/nano structure size effect on superhydrophobicity and anti reflection of single crystalline Si solar cells

Dry etching of polydimethylsiloxane used for bio-microfluidic systems

Fabrication of Micro/Nano Dual-Scale Structures by Improved Deep Reactive Ion Etching

Simple Approach to Wafer-Scale Self-Cleaning Antireflective Silicon Surfaces.

An Etching Method for Fabricating Anisotropic Silicon Nanostructures with Vertical and Smooth Sidewalls

Controllable formation and optical characterization of silicon nanocone-forest using SF6/C4F8 in cyclic etching-passivation process

Two Scale Roughness, Self-Cleaning, and Low Reflectivity Silicon Surface for Solar Cell Applications

Fabrication of antireflective layers on silicon using metal-assisted chemical etching with in situ deposition of silver nanoparticle catalysts

Anti-reflectance Investigation of a Micro-Nano Hybrid Structure Fabricated by Dry/wet Etching Methods

Self-Assembled Monolayer Islands Masked Chemical Etching for Broad-Band Antireflective Silicon Surfaces

The Preparation Of Self-Formed Pdms Nanostructures By Rie Etching