Abstract:Silicon nanostructuring imparts unique material properties including antireflectivity, antifogging, anti-icing, self-cleaning, and/or antimicrobial activity. To tune these properties however, a good control over features size and shape is essential. Here, a versatile fabrication process is presented to achieve tailored silicon nanostructures (thin/thick pillars, sharp/truncated/re-entrant cones), of pitch down to ~50 nm, and high-aspect ratio (>10). The approach relies on pre-assembled block copolymer (BCP) micelles and their direct transfer into a glass hard mask of an arbitrary thickness, now enabled by our recently reported regenerative secondary mask lithography. During this pattern transfer, not only the mask diameter can be decreased but also uniquely increased; constituting the first method to achieve such tunability without necessitating a different molecular weight BCP. Consequently, the hard mask modulation (height, diameter) advances the flexibility in attainable inter-pillar spacing, aspect ratios, and re-entrant profiles (= glass on silicon). Combined with adjusted silicon etch conditions, the morphology of nanopatterns can be highly customized. The process control and scalability enable uniform patterning of a 6-inch wafer which is verified through cross-wafer excellent antireflectivity (<5%) and water-repellency (advancing contact angle 158°; hysteresis 1°). It is envisioned the implementation of this approach to silicon nanostructuring to be far-reaching, facilitating fundamental studies and targeting applications spanning solar panels, antifogging/antibacterial surfaces, sensing, amongst many others.

Self-Assembled Monolayer Islands Masked Chemical Etching for Broad-Band Antireflective Silicon Surfaces

Langmuir−Blodgett Monolayer Masked Chemical Etching: an Approach to Broadband Antireflective Surfaces

Graphene Masks As Passivation Layers in the Electrochemical Etching of Silicon

Simple Approach to Wafer-Scale Self-Cleaning Antireflective Silicon Surfaces.

Ultra-Low-Reflective, Self-Cleaning Surface by Fabrication Dual-Scale Hierarchical Optical Structures on Silicon

Fabrication of antireflective layers on silicon using metal-assisted chemical etching with in situ deposition of silver nanoparticle catalysts

Synthesis of Large-Area Vertically Aligned Silicon Nanotip Arrays by Combining Silver Mirror Reaction with Metal-Catalyzed Electroless Etching

Broadband Antireflection Silicon Carbide Surface by Self-Assembled Nanopatterned Reactive-Ion Etching

Fabrication and Characterization of Inverted Silicon Pyramidal Arrays with Randomly Distributed Nanoholes

Antireflective SiC Surface Fabricated by Scalable Self-Assembled Nanopatterning

Preparation of Hydrophobic/Superhydrophobic Surface on Silicon Wafer by Reactive Ion Etching and Self-assembled Monolayers

Large-Scale Preparation of Uniform Nanopatterned Silicon Substrates by Inductively Coupled Plasma Etching Using Self-Assembled Anodic Alumina Masks

Elliptical silicon arrays with anisotropic optical and wetting properties

Fabrication of Large Area Subwavelength Antireflection Structures on Si Using Trilayer Resist Nanoimprint Lithography and Liftoff

Design Optimization and Antireflection of Silicon Nanowire Arrays Fabricated by Au-assisted Chemical Etching

Fabrication of Ultra-Low Antireflection SiNWs Arrays from Mc-Si Using One Step MACE

Micro/nano structure size effect on superhydrophobicity and anti reflection of single crystalline Si solar cells

A route to engineered high aspect-ratio silicon nanostructures through regenerative secondary mask lithography

Broadband Antireflective Silicon Carbide Surface Produced by Cost-Effective Method

Ultra-Thin Silicon Wafers Fabrication and Inverted Pyramid Texturing Based on Cu-Catalyzed Chemical Etching

Antireflection Subwavelength Structures Based on Silicon Nanowires Arrays Fabricated by Metal-Assisted Chemical Etching