Abstract:With the development of three-dimensional (3D) packaging technology, the dimension of solder joints is continuously shrinking. How to ensure the service performance of solder joints has become an important issue. As the solder joint height reduces to several microns, the total growth rate of Cu-Sn intermetallic compounds (IMCs) increases accordingly, meanwhile, whose proportion in solder joints will increase rapidly. At this point, the physics and mechanical characters of the solder joints won't depend primarily on the solder alloy, but on the IMCs. However, since the IMCs formed in solder joints have a non-cubic crystal structure, the IMC grains have a strong anisotropy along different crystal directions. Therefore, effective control of the orientation and growth behavior of IMC grains becomes a key issue in the 3D packaging fabricating. In the current study, the (001)Cu/Sn/Cu joints are fabricated by soldering under isothermy and temperature gradient (TG), respectively. Initially, the resultant η-Cu 6 Sn 5 grains show faceted prism textures with an intersecting angle of 90° on the (001)Cu end. However, in the isothermal soldering process, the initial faceted prism textures gradually disappear. By applying a TG, the IMCs on cold end, i.e. (001)Cu end, continue to grow rapidly and maintain the regular grain morphology. Moreover, the epitaxial growth direction of the IMCs is about parallel to the TG direction. These results provide a potential way to control the morphology and growth of Cu 6 Sn 5 grains in 3D packaging technology.

Continuous Epitaxial Growth of Extremely Strong Cu6Sn5 Textures at Liquid-Sn/(111)cu Interface under Temperature Gradient

Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient

Formation of preferred orientation of Cu 6 Sn 5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient

Growth Behavior of Cu<inf>6</inf>Sn<inf>5</inf> Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient

Growth Behavior and Orientation Evolution of Cu6Sn5 Grains in Micro Interconnect During Isothermal Reflow

Growth mechanism of Cu 3 Sn grains in the (111) Cu/Sn/Cu micro interconnects

Formation Mechanism and Reliability of Cu6Sn5 Textures Formed In-Between Liquid Sn and (111)/(001) Cu Single Crystals

Novel Growth Of Whole Preferred Orientation Intermetallic Compound Interconnects For 3d Ic Packaging

Three-dimensional Placement Rules of Cu6Sn5 Textures Formed on the (111)cu and (001)cu Surfaces Using Electron Backscattered Diffraction

Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM

Thermal and Compositional Fields to Maneuver Cu 6 Sn 5 Intermetallic Growth on (111) Nanotwinned Copper Substrate

In situ study on interfacial reactions of Cu/Sn–9Zn/Cu solder joints under temperature gradient

Growth Behavior of Cu6Sn5 Grains at Sn3.0Ag/(001)Cu Soldering Interface

Study on Cu6Sn5 Morphology and Grain Orientation Transition at the Interface of (111) Nt-Cu and Liquid Sn

Formation Of Highly Preferred Orientation Of Beta-Sn Grains In Solidified Cu/Snagcu/Cu Micro Interconnects Under Temperature Gradient Effect

Effects of Electromigration on Microstructural Evolution and Mechanical Properties of Preferential Growth Intermetallic Compound Interconnects for 3D Packaging

Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate

Morphology, Kinetics and Service Reliability of Cu6Sn5 Texture Formed on Sn/Cu Interface

Analysis and Control of Cu6Sn5 Preferred Nucleation on Single Crystal (0 0 1)Cu

Formation and evolution of irregularly arranged prism-type Cu6Sn5 grains on electroplated (111) textured Cu

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient