Abstract:Quasi-in-situ method was carried out to observe the growth behavior of intermetallic compounds (IMCs) in Cu/Sn-3.0Ag-0.5Cu/Cu micro solder joints with single β-Sn grain during aging with and without temperature gradient (TG). The bilayer IMCs of Cu6Sn5 + Cu3Sn showed symmetrical growth at both interfaces without TG, proving that β-Sn grain orientation had no effect on interfacial IMC growth during isothermal aging. Many Kirkendall voids were detected due to the dominated growth of Cu3Sn. However, during aging under TG, the IMCs in the joints with different β-Sn grain orientations showed quite different growth behavior and Cu6Sn5 was always the dominant IMC phase with little Cu3Sn and no Kirkendall voids formation. In the joints with small or medium θ angle β-Sn grains, remarkably asymmetrical IMC growth with thick Cu6Sn5 at the cold end and thin discontinuous Cu6Sn5 at the hot end was clarified. Meanwhile, the cold end Cu6Sn5 in medium θ angle joints also presented step-like morphology. The diffusion anisotropy of Cu atoms in β-Sn was responsible for the asymmetrical growth and step-like morphology. In the joints with large θ angle β-Sn grains, the Cu6Sn5 presented similar symmetrical growth to the isothermal aging cases. The different mechanisms of inhibiting Cu3Sn and Kirkendall voids formation at the cold and hot ends were revealed based on TG-induced Cu flux. Finally, a method was proposed to predict the IMC morphology and thickness considering β-Sn grain orientation, which could be helpful for reliability assessment and may also be suitable for IMC growth analysis under current stressing.

Formation Of Highly Preferred Orientation Of Beta-Sn Grains In Solidified Cu/Snagcu/Cu Micro Interconnects Under Temperature Gradient Effect

Heredity of preferred orientation of β-Sn grains in Cu/SAC305/Cu micro solder joints

The Effect of Pressure and Orientation on Cu-Cu3Sn Interface Reliability under Isothermal Ageing and Monotonic Traction Via Molecular Dynamics Investigation

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Investigation on growth of the orientation-preferred Cu6Sn5 on (001)Cu during the temperature-increased multiple reflow process

Investigating the preferential growth of Bi grains in Sn-Bi based solder under thermal aging

Solidification behavior of Sn crystals − Under different temperature gradients

A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction

Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding

The Effect Of Cu Orientation On Fracture Location In Cu3sn-Cu Interface Structure Under Monotonic Loading Condition By Molecular Dynamics Simulation

The Effect of Cu Orientation on Fracture Location in Cu<inf>3</inf>Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation

Thermal and Compositional Fields to Maneuver Cu 6 Sn 5 Intermetallic Growth on (111) Nanotwinned Copper Substrate

Effect of the anisotropic characteristics of β -Sn on current-induced solder evolution

Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate

Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process

Influence of inhomogeneous anisotropic Copper grains in TSV on the thermo-mechanical behaviors in the annealing process

Experimental and computational investigation of low temperature Cu-Sn solid-state-diffusion bonding for 3D integration

Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM

Formation and evolution of irregularly arranged prism-type Cu6Sn5 grains on electroplated (111) textured Cu

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

Enhanced reliability of Cu-Sn bonding through the microstructure evolution of nanotwinned copper