Abstract:The morphological evolution and grain orientations of intermetallic compounds (IMCs) were investigated during the formation of full Cu3Sn joints at two soldering temperatures (310 and 430 °C). The mechanical properties of both types of full Cu3Sn joints were then analyzed. The experimental results showed that the morphology of interfacial IMCs varied significantly at two temperatures. At 310 °C, scallop-like Cu6Sn5 grains became larger but were fewer in number and the top of the scallops became rough due to the grain ripening effect. With the increase in the soldering temperature to 430 °C, Cu3Sn no longer grew uniformly as observed during soldering at 310 °C, but exhibited various growth rates. Furthermore, some η-Cu6Sn5 transformed into η′-Cu6Sn5 during cooling, and the following orientation groups between η′-Cu6Sn5 and η-Cu6Sn5, i.e., {102}η′ and {<math>112‾0</math>}η, {112}η′ and {<math>101‾0</math>}η, and {<math>2‾01</math>}η′ and {0001}η, were found to be near-parallel. The Cu3Sn grains were preferably oriented with [203] and [100] crystal orientations parallel to transverse direction (TD) at both temperatures. Noteworthy, the Cu3Sn grains with [203]//TD and [010]//ND grew much faster than those with other orientations at 430 °C. Moreover, molecular dynamics simulation showed that the diffusion coefficients of atoms in Cu3Sn crystals along [203] direction were significantly greater than those in other low-index crystal directions. After soldering, two types of full Cu3Sn joints obtained at different temperatures exhibited different shear strength and fracture mechanisms.

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Diffusion anisotropy induced uneven regional growth of Cu6Sn5 IMC in Cu/SAC305/Cu micro solder joints under temperature gradient

Morphologies and grain orientations of CuSn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding

Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint

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Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints

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Thermal and Compositional Fields to Maneuver Cu 6 Sn 5 Intermetallic Growth on (111) Nanotwinned Copper Substrate

Study on morphology and interface relationship between Ag3(Sn, In) and Cu6(Sn, In)5

Cu aggregation behavior on interfacial reaction of Sn-3.0Ag-0.5Cu/ENIG solder joints

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

The In-Situ TEM Isothermal Aging Evolution in a μ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics

Reactive diffusion at the interface between Cu and Sn–Ag alloys

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Influence behavior and mechanism of crystal orientation of Cu 6 Sn 5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint

Microstructure Evolution and Mechanical Properties of Cu/Sn/Ag TLP-bonded Joint During Thermal Aging

Influence of Ag content on the formation and growth of intermetallic compounds in Sn–Ag–Cu solder

Formation of Sn Dendrites and SnAg Eutectics in a SnAgCu Solder