Abstract:The combined effects of thermomigration (TM) and electromigration (EM) were investigated in Cu/Sn3.0Ag0.5Cu/Ni solder joints by applying a 5×103A/cm2 DC current to the joints. With a thermal gradient, the Cu atoms and Ni atoms were found to migrate towards the lower temperature side while the Sn atoms were found to migrate towards the higher temperature side. For the solder joint stressed with a 5×103A/cm2 DC current, TM was found to play a dominant effect on the migration of Cu atoms in the solder because the Cu atomic flux in the solder which was induced by EM was smaller than that was induced by TM. The Ni atomic flux in the solder that was induced by TM was smaller than that induced by EM, but it could not be ignored because the values were the same order of magnitude. The Sn atomic flux induced by TM could be ignored due to its smaller magnitude than that induced by EM. The Cu3Sn IMC layer and Cu6Sn5 IMC layer at the Cu/solder interface in the joint with Cu as the anode were thicker than corresponding layers at the Cu/solder interface in the joint with Cu as the cathode. The IMC at the Ni/solder interface of joint with Cu as the anode was the Ni3Sn4 phase while that in the solder joint with Cu as the anode was the (Cu,Ni)6Sn5, and the former was thicker than the latter. EM and TM induced dissolution of the Ni3Sn4 IMC into the solder was found to be the main cause of the formation of voids at the Ni3Sn4/solder interface from a joint that used Cu as the anode. For the solder joint that used Cu as the anode, the Ni3Sn4 IMC layer at the Ni/solder interface was as thick as the Cu-Sn IMC layer at the Cu/solder interface. By contrast, for the solder joint that used Cu as the cathode, the IMC layer at the Ni/solder interface was thinner than that at the Cu/solder interf- - ace.

Cu aggregation behavior on interfacial reaction of Sn-3.0Ag-0.5Cu/ENIG solder joints

Morphologies and grain orientations of CuSn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Interfacial Microstructures of Sn3.8Ag0.7Cu and Sn37Pb Joints

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Formation of Sn Dendrites and SnAg Eutectics in a SnAgCu Solder

Insight into the influence of Cu6Sn5/Cu micro-interface configuration on growth behavior of Cu-Sn interfacial intermetallic compounds in Sn/Cu solder joint

Interfacial Reactions in Sn–20In–2.8Ag/Cu Couples

In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints

Influence of Ag content on the formation and growth of intermetallic compounds in Sn–Ag–Cu solder

Evolution of CuSn Intermetallics Between Molten SnAgCu Solder and Cu Substrate

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer

Reactive diffusion at the interface between Cu and Sn–Ag alloys

Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints

Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

Electromigration Effect Upon the Sn–0.7 Wt% Cu/Ni and Sn–3.5 Wt% Ag/Ni Interfacial Reactions

Intermetallic and tensile study of the newly developed Sn-2.0Ag-0.7Cu solder with addition of 0.5 wt.% zinc

Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Influence of Al2O3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints

Electromigration and Thermomigration in Sn3Ag0.5Cu Solder Joints