In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints

He Gao,Wei Liu,Rong An,Chunjin Hang,Yanhong Tian
DOI: https://doi.org/10.1016/j.jmrt.2023.08.112
IF: 6.267
2023-08-30
Journal of Materials Research and Technology
Abstract:This study investigated the fusion and phase-transformation processes of nano-intermetallic compound (nano-IMC) mixed solder pastes. In particular, the interfacial reaction with the Cu substrate, the kinetics and mechanism of Cu 6 Sn 5 growth inside the solder joint, and the shear strength of the solder joint were investigated. In-situ SEM and XRD results showed that the SAC305 and Sn–10Cu powders fused and the liquid solder ball completely melted at 227 °C. A higher initial Cu concentration in the mixed solder joints resulted in a lower Cu concentration gradient that inhibited the diffusion of Cu atoms. The growth activation energy of the IMC layer of a SAC305 + 20 wt% Sn–10Cu solder joint was 104.81 kJ/mol, which was higher than that of the SAC305 IMC layer (75.75 kJ/mol). During aging, Cu 6 Sn 5 rods within the mixed solder joint formed gullies on the outer facets, and the Cu 6 Sn 5 rods continued to grow along the [0001] crystal direction. The number of Sn grains and the proportion of high-angle grain boundaries in the mixed solder joints were higher after reflow. After aging at 150 °C for 1000 h, the shear strength of the SAC305 + 20 wt% Sn–10Cu solder joints was 34.25 MPa, slightly higher than that of SAC305 (33.12 MPa).
materials science, multidisciplinary,metallurgy & metallurgical engineering
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