Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Panju Shang,Feifei Tian,Zhi-Quan Liu

DOI: https://doi.org/10.3390/met14020139

IF: 2.695

2024-01-24

Metals

Abstract:It is difficult to confirm the existence of intermetallic compounds (IMCs) between SnIn and Cu, as their atomic numbers are very close, making it challenging to differentiate them through experimental tests. In order to determine IMCs and understand their growth mechanism, this study employed phase identification, morphology observation, and growth kinetics analyses on IMCs formed between In-48Sn solder and polycrystalline Cu substrate during liquid soldering. The experiments were conducted within a temperature range of 160~250 °C for up to 90 min. The obtained results indicated that IMCs formed at the interface depended strongly on the soldering temperature. During long-time soldering below 200 °C, one main IMC species, Cu2(In,Sn), was found at the In-48Sn solder/Cu interface, which showed two different morphologies: a coarse-grained layer at the solder side and a fine-grained layer within the Cu component. When the soldering temperature was increased to 200 °C, Cu6(In,Sn)5 was the only intermetallic compound (IMC) that formed at the point where the In-48Sn/Cu eutectic interface existed. At 250 °C, with an increase in the soldering time, there was a formation of Cu9(In,Sn)4 between Cu and Cu6(In,Sn)5. The growth kinetics analyses indicated that the fast grain boundary/molten-channel diffusion of Cu into solder and their reaction with solder controlled the growth of the interfacial IMCs, with the activation energy of 24.56 kJ/mol when the sample was liquid-state-aged above 200 °C.

materials science, multidisciplinary,metallurgy & metallurgical engineering

What problem does this paper attempt to address?

The paper aims to address the following issues:

The identification and evolution mechanism of intermetallic compounds (IMCs) formed between In-48Sn solder and copper substrate during the liquid soldering reaction process. Due to the very close atomic numbers of Sn and In, it is challenging to distinguish these IMCs through experimental testing, making it difficult to determine the presence of IMCs and understand their growth mechanisms.

The study conducted a detailed investigation of the IMCs between In-48Sn solder and polycrystalline copper substrate within a temperature range of 160~250°C through phase identification, morphology observation, and growth kinetics analysis. The research found that the formation of IMCs strongly depends on the soldering temperature, and different IMCs form at the interface as the temperature changes. Specifically, when soldering for a long time below 200°C, the main IMC is Cu₂(In,Sn), while at 200°C, the only IMC formed is Cu₆(In,Sn)₅. When the temperature rises to 250°C, Cu₉(In,Sn)₄ also forms. Additionally, the study analyzed the growth kinetics of IMCs and found that the rapid diffusion of Cu into the solder and their reaction with the solder control the growth of interface IMCs, with an activation energy of 24.56 kJ/mol.