Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

Xiaowu Hu,Tao Xu,Xiongxin Jiang,Yulong Li,Yi Liu,Zhixian Min

DOI: https://doi.org/10.1007/s00339-016-9893-1

2016-01-01

Applied Physics A

Abstract:The interfacial reactions between Cu and Sn3Ag0.5Cu (SAC305) solder reflowed under various cooling rates were investigated. It is found that the cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMCs) formed between solder and Cu substrate. The experimental results indicate that only scallop-like Cu 6 Sn 5 IMC layer is observed between solder and Cu substrate in case of water cooling and air cooling, while bilayer composed of scallop-like Cu 6 Sn 5 and thin layer-like Cu 3 Sn is detected under furnace cooling due to sufficient reaction time to form Cu 3 Sn between Cu 6 Sn 5 IMC and Cu substrate which resulted from slow cooling rate. Samples with different reflow cooling rates were further thermal-aged at 423 K. And it is found that the thickness of IMC increases linearly with square root of aging time. The growth constants of interfacial IMC layer during aging were obtained and compared for different cooling rates, indicating that the IMC layer thickness increased faster in samples under low cooling rate than in the high cooling rate under the same aging condition. The long prismatic grains were formed on the existing interfacial Cu 6 Sn 5 grains to extrude deeply into solder matrix with lower cooling rate and long-term aging, and the Cu 6 Sn 5 grains coarsened linearly with cubic root of aging time.