Abstract:Tungsten and tungsten-niobium alloy with niobium concentration of 5 wt% were exposed to deuterium plasma at ~470 – 506 K, with flux of ~1.8 × 1021 D/m2/s, an ion energy of 100 eV and fluence of 1.3 × 1025 D/m2 – 5.2 × 1025 D/m2. Before exposure, the hardness and Young's modulus as well as lattice parameter of W are improved due to Nb doping. After exposure, the TDS spectra can be deconvoluted into two major Gaussian peaks located at ~700–800 K and ~900–1000 K for all samples. At low fluence (1.3 × 1025 D/m2) and low temperature (470 K), only sparse and small blisters are formed on the pure W surface, while the strip-like surface structures are observed on the W-5Nb surface. The total D retention is significantly reduced due to the Nb doping, where the D retention in W-5Nb is 1.34 times lower than that of in pure W. With increasing fluence up to 2.6 × 1025 D/m2, both the blister size of pure W and W-5Nb alloy continue to increase. The blister size of W-5Nb alloy is slightly bigger than that of pure W, but the opposite trend is observed in blister density. The total D retention in W-5Nb alloy is also observed to be 1.38 times higher than that of pure W. Further increase of irradiation fluence (5.2 × 1025 D/m2) and temperature (506 K) at the same time lead to the significant increase of blister size and D retention for the pure W. However, whether the blister size or D retention are greatly suppressed in W-5Nb alloy. Moreover, the deuterium retention in W-5Nb is about 3 times less than that in pure W, implying that niobium alloying suppress the surface blistering and reduce the deuterium retention in tungsten exposed to D plasma with a fluence of 5.2 × 1025 D/m2 at 506 K.

Surface Topography and Deuterium Retention of Polycrystalline Tungsten and Nanocrystalline Tungsten Film Exposed to Deuterium Plasma

Fluence Dependence of Surface Morphology and Deuterium Retention in W Bulks and Nanocrystalline W Films Exposed to Deuterium Plasma

Effects of Tantalum Alloying on Surface Morphology and Deuterium Retention in Tungsten Exposed to Deuterium Plasma

Nanostructure Evolution and Surface Modification of Tungsten Exposed to Low Energy, High Flux Deuterium Plasma

Effect of Neon Plasma Pre-Irradiation on Surface Morphology and Deuterium Retention of Tungsten

Surface Blistering and Deuterium Retention in Tungsten Exposed to Low-Energy Deuterium Plasma at Different Temperatures

Blistering Behavior and Deuterium Retention in Tungsten Vanadium Alloys Exposed to Deuterium Plasma in the Linear Plasma Device STEP

Surface morphology and deuterium retention in tungsten exposed to high flux D plasma at high temperatures

Deuterium-induced Nanostructure Formation on Tungsten Exposed to High-Flux Plasma

Surface Modification and Deuterium Retention in Rhenium Doped Tungsten Exposed to Low Energy Deuterium Plasma

Surface Modification and Deuterium Retention of High Energy Rate Forging W-Y2O3exposed to Deuterium Plasma

Effect of Exposure Temperature on Deuterium Retention and Surface Blistering of Tungsten Exposed to Sequential Nitrogen and Deuterium Plasma

Blistering and Deuterium Retention in Nb-doped W Exposed to Low-Energy Deuterium Plasma

Effect of Anisotropic Grain Boundaries on the Surface Blistering of Tungsten Induced by Deuterium Plasma Exposure

Deuterium Retention and Surface Blistering in Non-Damaged and Damaged Tungsten after Repetitive Plasma Exposure and Outgassing

Deuterium Retention in Tungsten Films Deposited by Magnetron Sputtering

Deuterium Retention in Tungsten-Doped Amorphous Carbon Films Exposed to Deuterium Plasma

Surface blistering and deuterium retention behaviors in pure and ZrC-doped tungsten exposed to deuterium plasma

Surface modification and deuterium retention in hot-rolled potassium doped tungsten alloy exposed to deuterium plasma

Microstructure and Deuterium Retention of Tungsten Deposited by Hollow Cathode Discharge in Deuterium Plasma

Surface Blistering and Deuterium Retention in Chemical Vapor Deposition Tungsten Exposed to Deuterium Plasma