Investigation On Thermal Characteristics And Fabrication Of Duv-Leds Using Copper Filled Thermal Hole

Linlin Xu,Renli Liang,Hanling Long,Jiangnan Dai,Changqing Chen

DOI: https://doi.org/10.1109/ICEPT.2017.8046618

2017-01-01

Abstract:For deep ultraviolet light emitting diodes (DUV-LEDs) packaging, the choice of substrate directly affected its performance and reliability. In this paper, a structure was proposed to promote thermal management and lifespan of DUV-LEDs by introducing the ceramic substrate with copper filled thermal hole. The AIN ceramic substrates with different number of copper filled thermal holes were fabricated by electroplating process. And modeling and thermal simulation using finite element analysis(FEA) is developed by considering the geometrical model of AIN ceramic substrate with 0, 2x2, 3x3, 4x4 thermal holes. Meanwhile, to validate the simulation, the thermal parameters of DUV-LEDs were determined and measured by a thermal transient tester. It was found that thermal resistance and junction temperature decreased with the number of thermal holes increasing. Compared with traditional structure, the thermal resistance of DUV-LED based 4x4 thermal holes was reduced by 23.04%. This novel approach is believed to provide a simple and effective strategy for improving the heat dissipation and thermal reliability of DUV-LEDs.