Reduction of Structural Thermal Resistance for Deep Ultraviolet Light-Emitting Diodes Fabricated on AlN Ceramic Substrate via Copper- Filled Thermal Holes

Linlin Xu,Renli Liang,Jiangnan Dai,Hanling Long,Shuai Wang,Jingwen Chen,Jintong Xu,Xiangyang Li,Changqing Chen
DOI: https://doi.org/10.1109/TCPMT.2018.2812226
2018-01-01
Abstract:In this paper, a structure was proposed to promote thermal management of deep ultraviolet light-emitting diodes (DUV-LEDs) by introducing the aluminum nitride (AlN) ceramic substrate fabricated with copper-filled thermal holes (CFTHs). Different numbers of CFTHs (0,2 × 2,3 × 3, and 4 × 4) were formed in AlN ceramic substrates using direct-plated-copper process. The thermal resistance of DUVLEDs wa...
What problem does this paper attempt to address?