Abstract:INTRODUCTION ABSTRACT High power semiconductor lasers have found broad applications in solid-state laser pumping, direct materials processing, medical surgery, printing and manufacturing [1,2]. The maximum optical output power of semiconductor lasers, however, is limited by the temperature rise in the active region [3,4]. The self-heating of the lasers also causes other effects that degrade laser performance, such as wavelength shift, changes of the mode and beam profile, and shortened lifetime. The thermal management of high power semiconductor lasers and laser arrays is especially challenging due to the low thermal conductivity of their substrates and the functional layers used in these lasers [5,6]. Thermal management of high power semiconductor lasers and laser arrays is demanding and challenging due to the low thermal conductivity of the laser substrate and active device layers. In this work, metal heat spreaders of high thermal conductivity directly electroplated on the semiconductor lasers is investigated to improve the laser performance by avoiding the use of low thermal conductivity interface materials and thus reduce the thermal resistance of the lasers. Copper heat spreaders with different sizes are directly electroplated on the structures that mimic edge-emitting semiconductor lasers. The size effect of these heat spreaders is experimentally demonstrated through comparison with reference samples. A two-dimensional analytical model is developed to verify the thermal resistance experimental data. The results from the model fit the experimental data very well. The thermal characteristics and thermal management of semiconductor lasers have been investigated by various researchers [7-14]. Most of these works in thermal management use the configuration of junction-side-down mounting to spread the heat out, either passively through high thermal conductivity substrates [7-11, 13] or actively through integrated microchannel cooling systems [12, 14]. The laser is bonded to the heat spreader through relatively low thermal conductivity solder materials, which can limit the performance of the laser [7, 13]. NOMENCLATURE K thermal conductivity (W ) K m ⋅ 2 / R thermal resistance ( ) W K / Q heat (W ) A area ( ) 2 m W width ( ) m In this work, the use of copper heat spreaders directly plated on top of the laser is proposed to reduce the thermal resistance between the active heating region of the laser and the external cooling system. With its high thermal conductivity, an electrochemically plated copper heat spreader eliminates the use of the low thermal conductivity interface materials between the laser bar and the heat spreader, thus avoiding the bonding process and the interface imperfections generated in the soldering process. For example, voids in the soldering layer have been found to give rise to hot spots and therefore increase the thermal resistance [8]. L length ( ) m T thickness ( ) m B series constant

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