Abstract:Light-emitting diodes (LEDs) are a strong candidate for the next-generation general illumination applications. LEDs are making great strides in brightness performance and reliability; however, the barrier to widespread use in general illumination still remains the cost (dollars per lumen). For increasing the luminous flux of LED, the input power for chip of LED needs to be greater than before, and the thermal density inside LED will increase violently. However, the luminous efficiency and the life of chip will decrease at the high temperature condition, even the chip may be out of order or damaged. A good packaging technology is the way to solve the heat dissipation problem, but it is a challenge to develop this technology in the limited space of LED. The purpose of heat dissipating technology for LED is to decrease the working temperature of LED's chip. It is necessary to reduce the thermal resistance of LED package. The efficiency and reliability of solid-state lighting devices depends strongly on successful thermal management, because the junction temperature of the chip is the prime driver for effective operation. As the power density continues to increase, the integrity of the package electrical and thermal interconnects becomes extremely important.In this work, packaging experiments of high-power LEDs were studied using localized induction heating technique. The results show that, owing to the selectivity of induction heating with materials and geometry, only the electroless plated Cu-Sn alloy solder layer in chip area is heating and solder bonding between chip and copper-coated ceramic substrate is promised. Because of high thermal conductivity of Cu-Sn alloy, this novel packaging technique not only decrease the thermal resistance, making the p-n junction of LED kept at a low temperature even with a high current (four-fold of rated current), but also decrease thermal stress and avoid the damage of the chip, all of which will improve the performance and reliability of LED.

Study on thermal conductive adhesives for high-power LEDs packaging

Analysis of thermal spreading resistance in high power LED package and its design optimization

Experimental Study and Taguchi Analysis on LED Cooling by Thermoelectric Cooler Integrated with Microchannel Heat Sink

Study on die-bonding key technology of UV LED packaging

Research On Direct Plated Copper Heat Spreader And Its Thermal Performances For High Power Led Packaging

Study On Solder Bonding Technology And Its Failure Mechanism

Advances in Low Thermal Resistance Packaging for High-power LEDs

Progress on thermally conductive adhesive for electronic packaging

Heat transfer in high-power LED with thermally conductive particle-filled epoxy composite as thermal interface material for system-level analysis

Thermal and Optical Investigations of High Power Leds with Metal Embedded Printed Circuit Boards

Heat Dissipation Enhancement of High-Power LEDs Through Compact Ceramic Substrate Integrated With Microchannel

Enhanced Optical–Thermal Performances of High-Power LED by Plated Copper on Thick Film Ceramic Substrate

Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED

Improved Thermal Performance of High-Power Led by Using Low-Temperature Sintered Chip Attachment

Research on Localized Induction Heating for LED Packaging

Thermal Effects of Packaging Material and Structure on High Power White Leds

Heat Transfer In Thin-Film Packaging Of High-Power Led

Active Thermal Management of High-Power LED Through Chip on Thermoelectric Cooler

Impact of Flipchip Substrate Adhesive on the Thermal Characteristic of High Power LED

Design of high power LED lighting module and high efficiency heat dissipation structure

A Novel Heat Dissipation Material for High-Brightness Light-Emitting-diode Devices