Abstract:The industrial market has been growing for high-power ultraviolet (UV) LEDs in curing, water purifying, and other applications that required high light output. As a rule of thumb, LED lumen output usually drops 0.3-0.5% for each 1°C increase in temperature while operating within the typical working temperature range. Such requirements for high-power UV LED modules indicate that innovative materials and processes for module packaging are needed to reduce thermal conductivity and to ensure high reliability.In this work, UVA (wavelengths between 365-405nm) LEDs were chosen, since the increasing usage in curing equipment for drying paints, adhesives, and other curable materials. In order to reduce the thermal conductivity of UVA LED packages, a high power UV Chip on Board (COB) based LED module was simulated. Compared with traditional modules using silver-filled adhesive and metal-core printed circuit boards(MCPCB) substrate, the novel high power UV COB based module was using nano-silver material for die attach process. Such silver sintering method is emerging for high power electronics applications. Such substrate is then sintered on copper heatsink which is covered by a thin layer of graphene, for better thermal management. Such novel structure was investigated using ABAQUS software and the Heat Transfer Module. The simulation is intended to first check how much thermal conductivity reduce caused by nanosilver sinter die attach process. Secondly, the simulation will also investigate the graphene influence on the copper heatsink. Results from the simulation will show the typical structural function of a 200W LED module with reduced thermal resistance up to 7%. The module temperature with edge-to-center temperature difference will also be checked as a standard to compare the heat dissipation capacity. Besides, the simulation will provide temperatures in various parts of the LED module in steady-state conditions, as an indication for reliability.

Improved Thermal Performance of High-Power Led by Using Low-Temperature Sintered Chip Attachment

Improvement of high-power LED performance with sintered chip attachment

Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED

Analysis of thermal spreading resistance in high power LED package and its design optimization

Characterization of Low-Temperature Sintered Nanoscale Silver Paste for Attaching Semiconductor Devices

Thermal improvement of die attach by using PDMS-grafted particles as filler and Its application in solid state lighting

Emerging Lead-Free, High-Temperature Die-Attach Technology Enabled By Low-Temperature Sintering Of Nanoscale Silver Pastes

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Low-temperature attaching of LED chips using SnBiIn solder nanoparticles

Effect of heating rate on bonding strength of pressure-free sintered nanosilver joint

Heat Dissipation Enhancement of High-Power LEDs Through Compact Ceramic Substrate Integrated With Microchannel

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics

Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection

Improving Adhesion Strength and Thermal Conductivity of Nanowire Surface Fastener

Revolutionizing Power Module Manufacturing: Large Area Sintering with Silver Pastes for Enhanced Performance and Cost-Effectiveness

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Au80Sn20-based Targeted Noncontact Nanosoldering with Low Power Consumption.

Low-temperature and pressureless sintering technology for high-performance and hightemperature interconnection of semiconductor devices

Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

Thermal Simulations of a UV LED Module with Nanosilver Sintered Die Attach Process on Graphene-Coated Copper Substrates