Abstract:Reliable interconnection is a primary requirement for the fabrication of electronic or electromechanical devices in the bottom-up nanotechnology. At the current stage, although the position and fixation of functional elements through various methods have been achieved, the stable fixation process is still extremely difficult given the readily oxidative properties of the metal electrodes and the method for corresponding antioxidant protection by the dielectric coating. Here, we achieved a robust fixation of polyvinyl pyrrolidone (PVP)-coated silver nanoelectrodes and PVP-coated multiwalled carbon nanotubes (MWCNTs) through PVP pyrolysis at their interface. We comprehensively investigated the interface between the PVP-coated silver nanoelectrode and the PVP-coated MWCNT to better understand the leverage of the PVP protective layer on the electrical performance and joining strength properties during the self-soldering process. This self-soldering process is performed within an environmental scanning electron microscope by a nanorobot-assisted nanomanipulation system. Our results show that the conductivity of the soldered nanostructure is enhanced by about 1000 times after a 65 s vacuum annealing process. The PVP-coated MWCNT and the PVP-coated silver nanoelectrode were soldered together with a joining strength up to 112 MPa. The PVP protective layer and the subsequently formed amorphous carbon layer from the PVP pyrolysis provide good antioxidant protection for the whole soldering process. The PVP-coated silver nanoelectrode was also successfully positioned and soldered onto the silver pad, which verifies the feasibility of the provided self-soldering method. Additionally, our in situ investigation provides a reliable method for identifying metal or semiconductor materials and a temperature estimation method without any thermal sensors on the nanoscale. Our recipe highlights the promise of soldering dielectric-coated electrodes for fabricating nanoelectronic devices and transparent conductive films.

Au80Sn20-based Targeted Noncontact Nanosoldering with Low Power Consumption.

Optically Controlled Local Nanosoldering of Metal Nanowires

Nanosoldering of hetero-structures consisting of silver nanowires and gold nanoplate for interconnect

Photothermal‐Induced Nanowelding of Metal–Semiconductor Heterojunction in Integrated Nanowire Units

Nanorobot Assisted Self-Soldering Investigation Between PVP-coated Silver Electrodes and Carbon Nanotubes

In-situ investigation on melting characteristics of 1D SnCu alloy nanosolder

Laser-induced Single Point Nanowelding of Silver Nanowires

Laser Assisted Welding of Gold Nanowires

Mechanical and electrical cold bonding based on metallic nanowire surface fasteners.

Contact Annealing for Self-Soldering: in Situ Investigation into Interfaces Between PVP-Coated Silver Nanoelectrodes and Carbon Nanotubes

Nanoscale Characterization of 1D Sn-3.5Ag Nanosolders and Their Application into Nanowelding at the Nanoscale

Improving Adhesion Strength and Thermal Conductivity of Nanowire Surface Fastener

The Realization of ZnO Nanowires Interconnection through Femtosecond Laser Irradiation of Ag Nanoparticles Solder

Low-temperature attaching of LED chips using SnBiIn solder nanoparticles

Sacrificial Solder Based Nanowelding of ZnO Nanowires

Electrical Nanowelding and Bottom-Up Nano-Construction Together Using Nanoscale Solder

Bottom-up nanoconstruction by the welding of individual metallic nanoobjects using nanoscale solder.

Approaches to Nanosolder Reflow at the Nanoscale

Realization of the welding of individual TiO2 semiconductor nano-objects using a novel 1D Au80Sn20 nanosolder

Nanospot soldering polystyrene nanoparticles with an optical fiber probe laser irradiating a metallic AFM probe based on the near-field enhancement effect.

Pressureless Low-Temperature Sintering of Silver Nano-Solder Paste Based on Surface Activation