Reliability Modeling of High Power DUV LED Chips Based on New Thin Film Packaging Technology

Shuaiyi Pan,Huimin Xu,Xin Tan,Haoran Ma,Xiaochuan Xia,Hongwei Liang
DOI: https://doi.org/10.1109/icept59018.2023.10492288
2023-01-01
Abstract:The encapsulation technology of DUV-LED lamps is a current research hotspot in the field of photoelectric detection, and metal inorganic encapsulation materials are favored by researchers in this field because of their superior airtightness and thermal conductivity. The aluminum-based metal film is one of the typical inorganic materials, which has the advantages of UV resistance and reliability, and has broad application prospects in extreme environments and special scenarios. Based on this, this paper uses Comsol software to simulate and study the bonding and shear strength of the aluminum-based metal film and analyze the stress distribution and displacement changes. The results show that the stress distribution of the aluminum-based metal film is uniform and the reliability is subsequently improved under the protection of oxide film. This paper is expected to provide reference and feasible suggestions for the packaging of DUV-LEDs.
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